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Raymond So

Technical Manager at ASMPT Hong Kong
Intro Book
Raymond So is a seasoned technical professional with 3+ years of experience in process development, 9+ years in process engineering, and a Master's degree in Material Science (Electronic packaging) from The Hong Kong University of Science and Technology.
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Location
Hong Kong, Hong Kong SAR, HK
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Experience

  • ASMPT Hong Kong
    • 香港特別行政區
    • Technical Manager
      • Jul 2021 - Present
      • 香港特別行政區

      Process development - Study abd Develop possible solution for the following projects:Fan out Wafer/Panel Level Packaging TechnologyC2W Cu Hybrid Bonding Technology Cleanroom Facility Establishment

  • ASM Pacific Technology Ltd.
    • Hong Kong
    • Senior Process Engineer
      • Dec 2018 - Aug 2021
      • Hong Kong

      Fan Out Wafer/Panel Level Packaging Technology, C2W Cu Hybrid Bonding Technology

  • Abm Inc, Asia Pacific Ltd.
    • Hong Kong
    • Senior Equipment Engineer
      • Oct 2012 - Dec 2018
      • Hong Kong

      ABM is an equipment supplier in semiconductor industry. It has its own brand name product ABM Mask aligner which is used in photolithgraphy process and also selling different kind of front line equipment in wafer level fabrication.

  • Advanced Interconnect Technology Ltd
    • 香港特別行政區
    • Senior Process Engineer
      • Sep 2003 - Oct 2012
      • 香港特別行政區

      Provide Wafer Fabrication Process, Bumping and Bonding Services

  • Matrix Online (Hong Kong) Ltd
    • 香港特別行政區
    • 共同創辦人
      • Jan 2001 - Aug 2003
      • 香港特別行政區

Education

  • 2002 - 2003
    The Hong Kong University of Science and Technology
    Master's degree, Material Science (Electronic packaging)
  • 1999 - 2002
    HKUST
    Bachelor's degree, Mechanical Engineer (Building services)

Suggested Services

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Industry Focus. “Semiconductor Manufacturing”

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