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Rajiv K Singh is a seasoned semiconductor professional with 22 years of experience in design, development, and management of complex electronic systems. He has worked at Intel Corporation and LSI Logic Corporation, and has expertise in semiconductor design, methodology, and integration. He holds a degree from the University of Colorado Boulder and has experience in managing multiple teams and developing pre-silicon reliability collateral, tools, and flows.

Experience

    • Reliability Collateral, Tools, and Flows Manager
      • Nov 2009 - Present

      Manage multiple teams to create pre-silicon reliability collateral, tools, and flows based on industry standard EDA tools, focused on Electro-migration (EM), IR-Drop analysis, Aging, & ESD.

    • SoC Methodolody & Design Flows
      • Apr 2002 - Nov 2009

    • SoC Integration Methodology
      • Apr 1998 - Jan 2002

      Design Re-Use Methodology Development (CoreWare), MIPS Processor Implementation Support, Liquid Logic Core Developement

    • ASIC Customer Engineer (ACE)
      • Oct 1996 - Apr 1998

      Integrated customer ASIC designs into LSI Logic’s ASIC processes. • Interfaced closely with customers throughout the design process. This included: ASIC Methodology consulting, Synthesis Setup, Design Rule Checking (DRC), Formal Verification, Functional Simulation, DFT, Layout, ATPG, Test program debugging, and other ASIC signoff steps

    • Research Engineer
      • Oct 1995 - Oct 1996
      • Englewood, CO

      Provided Electrical Engineering expertise on a variety of control system applications.• Designed microprocessor control systems and controlling firmware for a family of data loggers. • Designed control and data acquisition system for a continuous mercury monitor.• Designed high voltage water dro...

Education

  • University of Colorado Boulder

Suggested Services

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Industry Focus. “Semiconductors”

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