Experience

• 

  onsemi

  • Hopewell Junction, New York, United States

  • Director Unit Process Module Engineering

    • Jan 2023 - Present
    • Hopewell Junction, New York, United States

• 

  IBM

  • Lean Transformation Manager for Semiconductor Manufacturing Solutions

    • Oct 2012 - Present

    - Develop improvement actions using LEAN methods across all aspects of enterprise including improvements in cost, productivity, quality and staffing.- Deploy LEAN tools into the organization focused on developing employee interest and building their skills therefore creating habits that improve the organization.- Created a program that enabled the leadership team to understand how their behavior can influence how their teams approach problems with LEAN thinking. Over a 2.5 year period every manager and senior technical leader has been through this program.- Member of Senior Leadership team to VP of Semiconductor Manufacturing Operations for IBM Fishkill, NY and Burlington, VT organization of >3000 employees. - Responsible for developing organizational improvement strategy including deployment, sustainment and measurement across organization.- Work directly with each part of the organization to develop strategic plans for manufacturing, engineering and development improving quality, cost and productivity.

  • Project Manager – CMP, Films, Wets Engineering

    • Sep 2005 - Nov 2012

    - Senior Manager for multiple process areas within the 300mm semiconductor plant. Management role responsible for 180 employees in engineering, maintenance and line support teams.- Responsibilities included 24x7 factory support, capital plans, capacity plans, waste reduction, yield improvement, cost reduction and staffing management.- Improved productivity across each area including improvement projects that reduced polishing scrap by 5x and year over year improvement in defects in each area.

• 

  GLOBALFOUNDRIES

  • United States
  • Semiconductor Manufacturing
  • 700 & Above Employee

  • Director Fab 10 Equipment Excellence

    • Jan 2018 - Jan 2023

  • Lean Transformation Manager for Fab 9 and Fab 10

    • Jul 2015 - Feb 2018

    - Develop improvement actions using LEAN methods across all aspects of enterprise including improvements in cost, productivity, quality and staffing.- Deploy LEAN tools into the organization focused on developing employee interest and building their skills therefore creating habits that improve the organization.- Created a program that enabled the leadership team to understand how their behavior can influence how their teams approach problems with LEAN thinking. Over a 2.5 year period every manager and senior technical leader has been through this program.- Member of Senior Leadership team to VP of Semiconductor Manufacturing Operations for IBM Fishkill, NY and Burlington, VT organization of >3000 employees. - Responsible for developing organizational improvement strategy including deployment, sustainment and measurement across organization.- Work directly with each part of the organization to develop strategic plans for manufacturing, engineering and development improving quality, cost and productivity.

• 

  IBM Server and Technology Group

  • East Fishkil, New York

  • Yield / Integration Manager

    • Mar 2004 - Sep 2005
    • East Fishkil, New York

    - Manager of integration engineering team responsible for technology development and introduction to manufacturing for middle and back end of line processes. - Responsible for yield improvement plans, defect reductions, design fixes and process capability improvements for multiple technology generations including 130 – 65nm nodes.- Developed yield improvement plans for 130 and 90nm technologies, including expectations for team and reporting standards.

• 

  IBM

  • Manager 300mm Thin Films Engineering

    • Aug 2001 - Mar 2004

    - Manager of Thin Films Engineering Department during start up of new 300mm semiconductor plant. - Responsible for 24x7 Engineering and Line Support teams including capacity sizing, capital planning, equipment selection and all hiring for the thin films area.- Focus team Chairman for Cu Plating technology responsible for tool evaluations and selection in new 300mm plant.- Drove 50% productivity improvement in both copper metal deposition and HDP insulator processes.

  • Thin Films Development Engineering

    • Jun 1996 - Aug 2001

    - Lead engineer for metal CVD for 200mm Development line. Responsible for all process control and process development.- Cu Plating engineer responsible for developing early Copper plating manufacturing processes for IBM technology. Developed manufacturing processes working with suppliers from laboratory equipment to mainstream manufacturing.