Experience

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  Girls in Tech, Inc.

  • San Francisco Bay Area

  • Intern

    • Jan 2017 - Present
    • San Francisco Bay Area

    ● Assisted marketing efforts for global non-profit focused on the engagement, education and empowerment of influential women in technology and entrepreneurship● Researched women’s rights and policies in various companies

• 

  BH

  • Korea

  • Technology Team Lead

    • Oct 2011 - Apr 2016
    • Korea

    Rigid Flexible and Flexible PCB CompanyManufacturing Technology Engineer: (Manufacturing Technology Team leader)● Patterning Process (Wet process): Stabilized the Quality (defect rate within 1.5%)○ Optimized Technology and Machines and Set-up Quality system.● Laminating(Hot/Vacuum Press) Process: Stabilized the Quality and Improved the Capacity ○ Collaborated with machine maker and sub material supplier○ Optimized Technology and Machines and Set-up Quality system.○ Developed the sub materials such as Separate films○ Optimized EMI shield and those conditions (Firsthand knowledge : The problem of EMI shield in PCB fabrication and theirs characters )○ High Volume stacked Laminating 510X500mm RF PCB ( 12 layers PCB ) ● Cu Plating Process (Wet process) : Stabilized the Quality and Improved the Capacity○ Optimized Technology and Machines and Set-up Quality system.○ Developed Direct Electroless plating chemical on Polyimide film, Full Size Top/bottom Clamping system for Thin Film in vertical continuing plating machine and chemicals and mechanical system for RA copper in Roll to Roll plating machine in order to prevent small bump on surface. ( Core technology in RA copper in RTR system)● Led new rigid flexible PCB developments and in huge volume for Samsung, Apple, etc.● Led main issues of Customer QA ● Completed the 6 Sigma black belt course ● Made & approved PCB Design Rule● Firsthand knowledge : Manufacturing technology, Quality issues, Quality and Design requirements and Technology trends in all manufacturing process of Rigid-flexible PCB, flexible PCB, Roll to Roll PCB and CCM.● Special Expertise : Cu plating, Patterning, Laminating, PCB material and Roll to Roll PCB ○ Collaborated with chemistry suppliers, machine maker and sub material supplier○ Figured out the chemical characters and ability and in order to optimizing the chemical, reviewing machine design and development new system

• 

  Korea Circuit

  • Technology and Quality leader

    • Dec 1999 - Apr 2011

    (Rigid and PKG Substrate PCB Company)Manufacturing Technology Engineer: (Manufacturing Technology Team Leader)● PKG substrate factory set-up : One of Leader in Quality and Technology○ Researched market & technology trends (Made plans, Chose machines) ○ Set-up Quality System: statistical methods of data analysis - SPC, DOE, FMEA, etc. ○ Led customer approval: Amkor, Sony, Micron, Hynix, TI, STM, , STATSchipPAC etc○ Led customer quality: audit, quality and design with RCCA on component design/technologies/processes in high volume, high reliability, and high availability systems○ Auditing: Internal and suppliers ● Project Leader for Full Automation Hot/Vacuum Press, Auto Cleaning System in Wet Line● Project Leader for setting-up Fill Cu plating machine and chemical ○ Figured out the chemical characters and ability and in order to optimizing the chemical, reviewing machine design and development new system ● Set-up Busless Au Plating Process: Au Resist, Patterning, Au plating, Cu plating, PSR● Set-up Fine Patterning(Wet line): MSAP (25/25um), * Development : 10/10um● Led customer QA: Amkor, Sony, Micron, Hynix, TI, STM, STATSchipPAC etc.● Abundant knowledge in Packaging and SMT reliability ● Made & approved PCB Design Rule ● Overall knowledge of PCB fabrication● Firsthand knowledge of manufacturing technology of all manufacturing process in PKG substrate and CCM. ● Led development of Flip Chip PCB ● Completed Course on TS16949 inspection ( Internal Auditor )● Firsthand knowledge : Manufacturing technology, Quality issues, Quality and Design requirements and Technology trends in all manufacturing process of Build-up PCB, PKG Substrate and CCM.,● Special Expertise : Cu plating, Patterning, Laminating, PCB material and Quality ○ Collaborated with chemistry suppliers, machine maker and sub material supplier