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Ming Kit Cheng is a seasoned scientist with expertise in materials analysis and nanotechnology. Based in Sunnyvale, California, he has worked extensively in the field of semiconductor manufacturing, providing analytical testing services to local and international companies. Cheng holds a Doctor of Philosophy (Ph.D.) in Nuclear, Plasma and Radiological Engineering from the University of Illinois at Urbana-Champaign, where he also earned a Master of Science (MS) degree. He has experience in conducting research and development in various fields, including plasma-surface interactions, nanomaterials, and nanostructures. Cheng is proficient in languages such as English and Chinese, and has a strong background in skills like Scanning Electron Microscopy, Matlab, and XPS.

Experience

  • Eurofins | EAG Laboratories
    • Sunnyvale, California, United States
    • SIMS Scientist
      • Oct 2021 - Present
      • Sunnyvale, California, United States

      Provide analytical testing services to local and international semiconductor manufacturing companies and universitiesExpertise in depth profiling of impurities and elemental composition of III-V semiconductors (GaAs, InP, GaN, Ga2O3-based optoelectronic wafers and devices) using secondary ion mass spectroscopy (SIMS)

    • United States
    • Higher Education
    • 700 & Above Employee
    • Graduate Research Assistant
      • 2014 - Oct 2021

      • Successfully developed and optimized depth profiling process to map the depth distribution of <1% tin contaminant within the first 10 nm of multilayer films exposed to tin plasma using in-situ XPS, ISS, and TEM, resulting in a poster• Discovered novel periodic nanostructures formed on Zr-based metallic glasses due to ion irradiation and resulting surface chemistry changes using SEM, AFM, in-situ XPS, and ISS, resulting in extension of the project grant for 1 year• Deciphered the role of surface chemistry changes using XPS in increasing surface hardness and preventing the collapse of ion-induced nanostructures on polymer, resulting in a publication in a high-impact journal• Individually analyzed surface topography and chemistry of 5 different types of materials after plasma/ion irradiation treatment using SEM, AFM, and XPS for 4 graduate students and a post-doc• Actively engaged in maintenance of analytical vacuum facility with ion beams and in-situ XPS equipment for 4+ years• Designed a new UHV facility for deposition of a-Se thin films by thermal evaporation for large-area radiation detector

    • Teaching Assistant
      • 2014 - May 2018

      • Led two teams of two to design and execute small-scale experiments on plasma-surface interactions• Concisely explained fundamentals and guided students to tackle homework problems for plasma engineering courses• Provided journal articles for presentations and led follow-up discussions for 20 students in a plasma engineering course

    • Undergraduate Research Assistant
      • Feb 2013 - Aug 2014

      • Improved breakdown voltage and leakage current of low-k dielectrics by ion implantation• Characterized electrical properties of plasma processed semiconductors for 2 graduate students

Education

  • 2014 - 2021
    University of Illinois at Urbana-Champaign
    Doctor of Philosophy (Ph.D.), Nuclear, Plasma and Radiological Engineering
  • 2014 - 2017
    University of Illinois Urbana-Champaign
    Master of Science - MS, Nuclear, Plasma and Radiological Engineering
  • 2010 - 2014
    University of Wisconsin-Madison
    Bachelor of Science (B.S.), Engineering Physics

Suggested Services

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Industry Focus. “Nanotechnology”

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