Experience

• 

  Integrated Micro-Electronics, Inc. (IMI Global)

  • Corporate Quality Head

    • Jan 2017 - Present

• 

  SUNPOWER PHILIPPINES MFG. LTD

  • Sr QA Manager

    • Jan 2013 - Dec 2016

    Managed the overall planning, operation and functional execution, and continuous improvement of the Quality Assurance team in the module assembly process

  • Cell Technology and Deployment Mgr

    • Jun 2012 - Dec 2012

    Engaged in development projects for Wet Etch /Print/LC group under Cell Technology and Deployment -RDD Department

  • Process Engineering Manager, Manufacturing Engineering Department

    • Sep 2010 - May 2012

    Fab 1 in Laguna)- 1.7 yrs; Managed the overall planning, operation and functional execution, and continuousimprovement of Wet Etch and Print group under the Engineering Department.

• 

  INTEL TECHNOLOGY PHILIPPINES INC

  • APAC Metrology and Materials Analysis Lab Manager

    • Jan 2006 - Jan 2008

    Assembly/Test Global Materials (2006 - 2008) – 2 yrs* Managed the overall planning, operation and functional execution, and continuousimprovement of the Asia Metrology and Materials Analysis Labs located in Cavite (Phil),Penang (Malaysia), and Pudong (China); Provided technical expertise and effective resource management with virtual groups (i.e., development groups at different regions) in proliferating and qualifying Supplier Metrology (e.g., substrates, polymers, heat sinks and sockets)

  • Department Manager

    • Jan 2005 - Jan 2006

    * Managed the overall planning, operation and functional execution, and continuousimprovement of the Package FA group in exceeding its critical success indicator goals.* Enabled the Technical Services lab in achieving its safety and security goals (zero safetyincidence).* Managed the Q&R lab equipment uptime performance * Sustained the operational health of the Intel’s Phil Laboratory Manager Council leading theSMBWA (Site Management By Walking Around) in the non Q&R labs and sharing among labsthe safety and security BKMs (Best Known Methods) of the Q&R lab.

  • Section Manager, Package Failure Analysis Laboratory and Technical Services Laboratory

    • Jan 2004 - Jan 2005

    * Managed the acquisition of Competency and Capability of Site on Surface Analysis andMaterials Analysis; Supervised Defect Identification and Root-Cause Fix critical to acceleration of product introduction in CPU, Flash, Chipset/Network Communication

• 

  ON SEMICONDUCTOR PHILIPPINES (OSPI)

  • Department Manager

    • Jan 2002 - Jan 2004

    Managed the overall planning, operation and functional execution, and continuousimprovement of the Quality and Reliability department in support of assembly and testprocess groups in delighting customers; Headed the team towards successfully upgrading of OSPI’s Quality Management System to TS16949:2002; Spearheaded the Materials Science Program for Engineers under the Carmona University

  • Staff Scientist

    • Jan 1999 - Jan 2002

    Introduced a systematic procedure for materials selection of carrier tape and cover tape usingthermal analysis (DSC, TGA, TMA); Spearheaded evaluation of low cost and improved molding compounds for PLCC/SOIC/TSSOP packages; Initiated innovative projects like evaluation and qualification of non-halogenated molding compounds (GREEN MOLDING COMPOUNDS) for SOIC and TSSOP packages; Simplified the mold process through optimization of cure time of molding compounds (introduced the isothermal cure kinetic study as basis for completion of mold reaction)

• 

  UNIVERSITY OF THE PHILIPPINES

  • Associate Professor

    • Jan 1980 - Jan 1999

    Taught undergraduate General Chemistry, Organic Chemistry, Analytical Chemistry classes andgraduate courses on Polymer Science, Organic Chemistry, and Liquid Crystals Science; Conducted several researches with DOST and Industry ; Supervised thesis work of B.S., M.S., and Ph.D. students