Bio
Experience
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PCB Expert
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Sep 2015 - Present
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北京
PCB/FPC placement, routing, DFM check, Data release and engineering confirmation with PCB/FPC suppliers Cooperate with package team to review package design/ballmap optimization/pin delay optimization. Have SI knowledge/design experience for PCIE3.0/PCIE4.0/LPDDR4/LPDDR4X/LPDDR5/MIPI Have PI-knowledge/design experience for core power supplies! (40A) Export reference Chip PCB design for customers Review PCB design for customers Chief PCB designer for Xilinx VU19P chip verification platform board Chief PCB designer for J2/J3/J5 (Journey platform) Chief PCB designer for X1/X2/X3(Sunrise platform)
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Microsoft
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Beijing City, China
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PWB/FPC Expert
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Apr 2014 - Sep 2015
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Beijing City, China
-Design for PCBs/FPCs for Microsoft Mobile Devices.-Lead cost down activites in PCB/FPC area.-Concept study for new programs.-Contact widnow with global FPC technology team and local consultant in FPC area (including technology selection/improving, cost down ideas, cooperation with suppliers, quality issues solving, etc.).-Chief PCB/FPC designer for Lumia 730 and Lumia 735.
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Nokia
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Beijing City, China
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PWB/FPC Expert
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Apr 2011 - Apr 2014
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Beijing City, China
-Design for PWBs/FPCs for Nokia Mobile Devices.-Lead cost down activites in PWB/FPC area.-Achieve 2 layers reduction for mainboard of Lumia 520 (1usD/pcs cost saving).-Contact widnow with global FPC technology team and local consultant in FPC area (including technology selection/improving, cost down ideas, cooperation with suppliers, quality issues solving, etc.).-Chief PWB/FPC designer for Lumia 520(the best sales windows phone in the world).
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Sasken
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北京
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Senior PWB Enginer
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May 2010 - Mar 2011
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北京
-Onsite support in Nokia Beijing(May.2010-Mar.2011)-Design for PWBs/FPCs for Nokia Mobile Devices.-Impedance calculation for ctirical traces (like RF,CSI,DSI,USB...)
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BYD
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Beijing, China
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Sr.PWB Engineer & PWB Leader
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May 2007 - Apr 2010
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Beijing, China
-Onsite support in Nokia Beijing(May.2007-Jun.2008).-Onsite support in Nokia Ulm(Oct.2008-Nov.2008)-Design for PWBs/FPCs for Nokia Mobile Devices (Nokia Beijing and Nokia Ulm).-Impedance calculation for critical traces (like RF,CSI,DSI,USB...).-Cross function review with other team members.-Support profuction line (like SMT...).-Manage PWB team, training activities,supplier activities.-Contact window with Nokia PWB technology team.-Chief PWB/FPC designer for Nokia 2600c(Bar),Nokia 7310c(Bar)
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LG Electronics
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Yantai, Shandong, China
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PCB Engineer
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Jul 2004 - May 2007
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Yantai, Shandong, China
-Design for PCBs/FPCs(Multi layers) for LG Mobile Devices.-Window of contact and trouble-shootig with PCB/FPC suppiers.-Cross fuction review with other team members.-Support production line (like SMT...).-Develop new PCB/FPC suppliers (cooperate with sourcing, quality...).-FPC quality test and improvement (like folder test, slike test...).-Calibration/IM2 and other electronics performance test.-CAD tool training and PCB knowledge sharing to new comers, Zuken Server Administrator.-Chief PCB/FPC designer for LG-C680 (Folder), LG-KX236(Slide), LG-KX206 (Bar),LG-KX256(Bar).-GB Certificate of 6 sigma (Sep.2005) in LGEYT.-Advanced Individual (Jan.2007) in LGEYT.
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Education
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2000 - 2004Shandong University
Bachelor of Engineering (BEng), Major in Communication Engineering
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