Experience

• 

  Broadcom Limited

  • United States
  • Semiconductor Manufacturing
  • 700 & Above Employee

  • Process Development Engineer

    • Jan 2017 - Present

    Defect Inspection engineering in integrated circuit manufacturingControl and develop processes for high end automatic defect inspection equipment

  • Senior Process and Facilities Design engineer

    • May 2016 - Dec 2016

    Applying broad experience to re-commission a mothballed integrated circuit plant. Responsible for facilities process systems and capacity modeling.Developing capacity model for the planned processWorked with engineering firm to prepare design documents

• 

  Toyo Tanso

  • Troutdale, OR

  • Process Engineer, Project Engineer, Process Development

    • 2007 - Apr 2016
    • Troutdale, OR

    Graphite Purification and Silicon Carbide Coating Process EngineerApply lean manufacturing principles to scrap reduction, cycle time improvement, and cost reduction as well as develop processes, lead equipment installation such as a toxic/flammable gas detection system.Managed project to release SiC surface cleaning process new to Toyo Tanso USA.Managing project transitioning from environmentally unacceptable gas precursor to significantly more environmentally manageable gases.Provided R&D to innovate system for coating graphite with Silicon Carbide.Creating systems that breed accountability and consistency in the process environment.Designing systems to significantly tighten control as well as safety of critical gas delivery process.Working with the process technicians and operators to improve product quality through best practices.

• 

  Cascade Microtech

  • Beaverton, OR

  • Facilities Manager

    • 2006 - 2007
    • Beaverton, OR

    Facilities Manager Managed facilities, infrastructure, and improvement projects for membrane type manufacturing plant.Designed pH waste treatment upgrade for cleanroom and managed installation.Designed and managed installation of metal sputtering equipment.Implemented major facilities control system upgrade.Specified and managed contracts with mechanical and electrical firms working on site.

• 

  Hewlett Packard

  • Materials Research and Development Engineer

    • 1998 - 2005

    Lead materials development, material reliability studies, and diffusion modeling for ink-jet applications.Lead a diverse team that assured reliability of the ink-jet print head electrical connection for a printer with demanding space and ink requirements.Managed a program between two sites to invent a small diameter rubber tubing material, which has significant confounding requirements, on a printer development schedule.Established accurate mathematical models for solvent loss from ink delivery systems for product life prediction. The models matched well with experimental results.

  • Facilities Engineer, Integrated Circuit Factory

    • 1988 - 1998

    Engineering design and process control for ultra-pure water, chemical delivery, gas delivery, and waste treatment systems.Directed design and installation of ultra-pure water system upgrade for leading edge integrated circuit factory to exceed next generation product requirements.Consulted for and specified retrofit of bulk chemical delivery system for Ft. Collins integrated circuit factory moving to larger wafers, while working in Corvallis.Modeled ultra-pure water distribution system with KY Pipe software to plan system retrofit for next generation of integrated circuits.Technically lead design and installation of hot ultra-pure water plant in Corvallis for new 8” wafer tools to greatly improve yield.Lead a team that created an ISO9001 plan for integrated circuit facilities group and prepared for certification.Managed and designed installation of safe, ultra-pure, toxic gas systems for integrated circuit manufacturing to go beyond code requirements.Managed installations of nitrogen and hydrogen delivery systems in Ft. Collins to meet 2-fold increases in capacity.

  • Process Engineer, Integrated Circuit factory

    • 1984 - 1988

    Improved integrated circuit manufacturing processes to achieve Cpk > 1.5 for better yield and reliability.

• 

  UNITED STATES MARINE CORPS

  • Various

  • Korean Linguist, Sergeant

    • Jul 1976 - Jun 1980
    • Various

    Interpreted Korean language to maintain the peace between North Korea and South Korea.