Experience

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  Andson Biotech

  • Atlanta Metropolitan Area

  • Microfabrication Engineer

    • Jan 2024 - Present
    • Atlanta Metropolitan Area

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  Abbott

  • Atlanta, Georgia, United States

  • Product Development Engineer II | Heart Failure Research and Development

    • Nov 2021 - Jan 2024
    • Atlanta, Georgia, United States

    • Collaborated as a member of a Research & Technology team which was focused on the development of hermetic MEMS pressure sensors for the biomedical application space. • Applied DFx principles across multiple aspects of sensor architecture design and MEMS process development. • Designed and executed experiments aimed at improving sensor yield, performance, and reliability.• Developed protocols for the characterization of sensors and sensor materials in support of root cause failure analysis investigations; characterization techniques include: package cross-sectioning and SEM, thermogravimetric analysis (TGA), differential scanning calorimetry (DSC), residual gas analysis (RGA) per MIL-STD 883 TM 1018, outgassing analysis per ASTM E 595.

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  KLA

  • Ann Arbor, Michigan, United States

  • Product Development Engineer I | LS-SWIFT Division

    • May 2020 - Nov 2021
    • Ann Arbor, Michigan, United States

    • Performed statistical analysis to validate calibration/diagnostic critical parameter specification limits for a prototype wafer inspection system and organized weekly reviews with manufacturing and design engineering stakeholders. • Provided remote technical support to field engineering teams to resolve system nonconformance issues reported at customer fabs. • Led systems engineering product lifecycle activities for a new wafer inspection system through the planning phase and beta-tool development. Facilitated alignment between Marketing, Manufacturing, Systems, Software, and Applications Engineering stakeholders through weekly reviews. • Led engineering efforts to implement/validate a method for matching sensitivity between wafer inspection systems with dissimilar illumination and collection architectures.• Completed basic Applications Development Engineering training (L1) for KLA patterned wafer defect inspection platforms (operational principles, recipe creation, and analysis of inspection results).

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  Abbott

  • Atlanta, Georgia, United States

  • Research And Development Intern - CardioMEMS

    • Jan 2018 - May 2020
    • Atlanta, Georgia, United States

    • Investigated the electromechanical properties for various MEMS capacitor geometries using analytical models in MATLAB.• Prototyped hermetically packaged MEMS pressure sensors and identified mechanisms for potential failure modes.• Investigated the challenges associated with fabricating interconnects for implantable hermetic glass packages.• Developed a process library for a CO2 Laser System consisting of programs for alignment (X, Y, θ), shadow mask production, blind-via fabrication, dicing, and inscription, providing laser micromachining capability to the Abbott R&D Sensor team.

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  IM Flash

  • Lehi, Utah, United States

  • Process Integration Intern

    • May 2019 - Aug 2019
    • Lehi, Utah, United States

    • Investigated correlation between FEOL/BEOL process queue-times and yield/parametric responses using models in JMP. • Applied semiconductor fabrication knowledge to develop models to explain correlation between process queue-times and yield/param data.• Performed an experiment to improve manufacturing throughput by eliminating an FEOL process module. Device functionality was retained through the modification of a later FEOL process step.

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  Georgia Tech 3D Systems Packaging Research Center

  • Atlanta, GA

  • Process Engineering Support

    • Dec 2017 - Aug 2018
    • Atlanta, GA

    • Designed experiments to improve the adhesion between substrate and build-up metallization by means of surface treatments prior to metal deposition, in support of the development of a novel low temperature hermetic packaging solution for solid-state Lithium-ion batteries in glass ceramic substrates.• Utilized SEM to characterize high aspect ratio (>5) photoresist critical dimensions in support of process development.

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  Georgia Tech Institute for Electronics and Nanotechnology

  • Process Engineering Support

    • Jan 2016 - Dec 2017

    • Trained graduate students and industry researchers in laser confocal microscopy, SEM & EDX.• Characterized photolithography processes (spin coating, baking, exposure/dosage, and development parameters) for several species of commonly used photoresist available in GT IEN cleanrooms.

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  Semtech

  • Camarillo, CA

  • Semiconductor Failure Analysis Intern

    • May 2017 - Aug 2017
    • Camarillo, CA

    • Utilized a range of diagnostic test equipment and characterization tools including oscilloscopes, SEM, EDX, Photon Emission, IR and liquid crystal circuit analysis to locate die-level failure mechanisms in various microelectronic packages.• Investigated the failure mechanisms of the top ten failure modes for a chip-scale packaged SAR controller for a prominent mobile device manufacturer as a part of their qualification process.