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Experience

  • nonda
    • Shanghai City, China
    • Hardware Partner
      • Jul 2015 - Jan 2018
      • Shanghai City, China

      Built smart hardware products. From concept, design, validation, to mass production. Built hardware R&D and manufacturing team, including EE, Firmware, Mechanical and Quality team for consumer and automotive aftermarket products. Supplier Management, including make supplier management plan, supplier control and performance improvement.Make new technical studies base on company target. Hardware cost control and high-quality delivery.1. Build and manage hardware and manufacturing team, and the supply chain structure.2. Plan, manage, and own the whole life cycle of smart hardware, at multiple vendor sites.3. Source and audit suppliers for various components, assemblies, or processes.

  • CETC
    • Shanghai City, China
    • System Architect
      • Apr 2013 - Jul 2015
      • Shanghai City, China

      Led the development and delivery of high-reliability systems, led a cross-functional team of electrical, software and mechanical engineers to recognize, assess and communicate cross-functional issues and risks for a complex application.1. Designed HA application servers and High-Density systems based on VPX/ARINC/SSI/VME /ATCA platforms with vary micro-architecture CPUs, including x86/MIPS/Alpha or FPGA cores. 2. Designed rugged rack-mount server for special environment application, like the airborne computer, vehicle-mounted system, and shipborne application, based on vary CPU architectures and different network technologies like PCIe/GbE/SRIO.3. Designed and implement rugged embedded HPC products and COTS components for special environment application. 4. Supported marketing activities, provide pre-sale demonstrations and technical discussion with customers, provide design and implementation proposal of environment-specified systems. 5. Initialized RFP and RFQ proposal, products’ specification, and validation plan.6. Applied three patents (Issued).

  • Intel Corporation
    • Shanghai City, China
    • Product Design Engineer
      • Nov 2010 - Apr 2013
      • Shanghai City, China

      Conducted server/storage design, analysis, testing and manufacturing for 19" rack-mount systems, including 1U/2U/5U/6U and server/storage/workstation systems. 1. Worked with architect team to develop next-generation platforms, including server, workstation, blade server, and entry-level storage products. 2. Responsible for system development activities, as major contact window for Thermal / Mechanical / Power Supply team to PDT. 3. Responsible for System Validation on multiple SKUs of silicon, hardware components, and systems. including system level environmental validation (Dynamics, Climatic, EMC, RVI, etc.). Managed suppliers' validation work in the ODM model. Interact with ODM on test plan review, debug, test result review and follow up with mass production issues. 4. Provided direct technical support to the customer with the marketing team.

  • Foxconn
    • Shenzhen, Guangdong, China
    • System Engineer
      • Jul 2005 - Oct 2010
      • Shenzhen, Guangdong, China

      Worked in Server Design Center, responded RFP and RFQ for ODM model projects. Integrated the thermal/power/EE/mechanical/packaging design and work with manufacturing team to solve manufacturing issues. Initialized system level BOM and specification. Supported sample build, include testing and validating new products. Provided engineering support for delivery of systems to customers, including support at factories during product, builds as well as support at integration facilities to ensure systems are correctly built, integrated on chassis/rack/container level.

Education

  • 2009 - 2013
    Harbin Institute of Technology
    Master's degree, Computer Engineering
  • 2001 - 2005
    Xihua University
    Bachelor's degree, Electrical and Electronics Engineering

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Industry Focus. “Computers and Electronics Manufacturing”

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