Bio
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Dan Leung is a seasoned engineer with 26 years of experience in the semiconductor industry, holding leadership positions at SiFive, Open-Silicon, Lightspeed Semiconductor, and Atmel Corp, with expertise in NPI, Assembly & Packaging, and Mechanical Engineering from the University of California, Berkeley.
Experience
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Sr. Director, NPI
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Jun 2018 - Present
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Director, Assy & Packaging
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Dec 2003 - Present
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Director, Assembly & Packaging
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Mar 1999 - Nov 2003
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Manager, Assembly / Packaging
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1988 - 1998
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Packaging Engineer
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1988 - 1989
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Packaging Engineer
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1986 - 1987
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Education
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1981 - 1985University of California, Berkeley
Bachelor of Science (BS), Mechanical Engineering
Suggested Services
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Industry Focus. “Semiconductors”
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