Bio
Experience
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Samsung Electro-Mechanics
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Suwon, Gyeonggi-do, Korea
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EVP
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2010 - Present
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Suwon, Gyeonggi-do, Korea
All kinds of semiconductor components except standard ICs:Passive components (R, L, C), PCB, chip substrate, ISM, HDD motor, Power module, Wireless connectivity module, WPT, adaptor, TSM, sensors, ESL, Power control chip, Zigbee chip, etc.
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SVP
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1984 - 2010
Memory Product Planning and Application Engineering TeamAdvanced Memory Development: DRAM, NAND, PRAM, RRAM, MRAM High speed DRAM Design & Development
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Education
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1989 - 1995University of Michigan
Ph. D., EE -
1982 - 1984Seoul National University
Master of Science (MS), Semiconductors -
1978 - 1982Seoul National University
Bachelor's degree, Electrical and Electronics Engineering
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Industry Focus. “Appliances, Electrical, and Electronics Manufacturing”
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