Bio
Experience
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United States
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Semiconductor Manufacturing
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700 & Above Employee
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Staff Hardware Eng
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Aug 2015 - Present
• High speed board design up to 10G, burid resistor desing • Bring-up the components arrived from tapeout.• Involve in the chip Ball-out definition in aspect of High-speed• Electrical characterization, high-speed SerDes interfaces (USB3/2, SGMII, SATA, 10G..)
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Integration Team leader
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Jan 2008 - Aug 2015
• Integration Technical leader in the fields of HW design, Power Delivery, low power design, signal integrity, Heat dissipation, Charging, WiFi, GPS, 2G, 3G, LTE, antenna location, coexisting… • Lead the reference design of the MiFi, USB Dongle, mPCI card & cellular phone.• Leading the board “Bring-UP”, responsible for Hardware boards troubleshoots and Integration in LAB• Work with the SW team / Validation in order to solve a complex issue.• Good team player
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Technical leader - Analog and RF Evaluation team.
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Jan 2004 - Jan 2008
• Technical leader for a group of approximately 3 engineers and 3 students.• Lead PMIC, Audio codec IC’s and RF boards evaluation. • Formulating testing method for complex components, including AFE, RF and Audio Codec.• Formulating technical specifications for Mixed-Signal Chip
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Analog / RF Engineer
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Sep 2000 - Jan 2004
• Writing the documentation and design the testing plan on ATE• Board Design – Mix signal board for ATE for mixed-signal chip. • Test plan for Audio, Power ,ADC , DAC, PGA and Filters.• Advanced course in LabVIEW software.• Defining the testing method for complex components, including AFE, RF and Audio Codec. Providing solutions for complex requirements in order to verify the functioning of the components in their specified range. • Knowledge in analog systems, systems perspective, RF knowledge.
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Motorola Cellular Division
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Tel Aviv Area, Israel 3/1999 – 9/2000:
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Hardware Engineer, Cellular Division
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Mar 1999 - Sep 2000
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Tel Aviv Area, Israel 3/1999 – 9/2000:
# Mixed Signal Board Design - analog circuits - Filters, Op Amp.# Accompanying products from development to production in TDMA and EDGE projects.# Travel abroad to provide immediate support.
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Education
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1996 - 2000Ben Gurion University
Engineer’s Degree, Electrical and Electronics Engineering
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Industry Focus. “Semiconductor Manufacturing”
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