Tezzaron® Semiconductor Corporation specializes in 3D wafer stacking and TSV processes. The company demonstrated the world's first successful wafer-stacked 3D-ICs back in 2004, including stacked microprocessors, stacked sensors, and stacked SRAM devices. With our DiRAM4 prototype complete, we are turning our attention to foundry and product partnerships that will allow the emergence of a robust ecosystem for all sorts of DisIntegrated 3D™ (Di3D™) products, including memories, FPGAs, ASICs, SOCs and more.
