Experience

Tezzaron Semiconductor

• United States
• Semiconductors
• 1 - 100 Employee

• Integrated Circuit Layout Engineer

  • Jan 2013 - Present

  Layout design of 3D stacked Integrated Circuits Layout design of 3D stacked Integrated Circuits



Philips

• Netherlands
• Hospitals and Health Care
• 700 & Above Employee

• Printed Circuit Designer

  • Jun 2011 - Aug 2011

  Created layouts of double-sided and multilayer printed circuit boards for LED lighting power supplies and controls. Used Cadstar software. Employed as a contractor through Adecco Engineering & Technical Services. Created layouts of double-sided and multilayer printed circuit boards for LED lighting power supplies and controls. Used Cadstar software. Employed as a contractor through Adecco Engineering & Technical Services.



Peregrine Semiconductor

• United States
• Semiconductors
• 100 - 200 Employee

• Integrated Circuit Layout Technician

  • Dec 2010 - Jun 2011

  Layout of mixed mode RFIC circuits in UltraCMOS process (silicon on sapphire) 0.5 and 0.25 micron technologies. Design for bond wires, bump pads and thermal bump posts, and create bond wire drawings using Carsem and Unisem packaging. CAD tools included Cadence Virtuoso and Schematic Capture, DRC, LVS, and tape-out. Layout of mixed mode RFIC circuits in UltraCMOS process (silicon on sapphire) 0.5 and 0.25 micron technologies. Design for bond wires, bump pads and thermal bump posts, and create bond wire drawings using Carsem and Unisem packaging. CAD tools included Cadence Virtuoso and Schematic Capture, DRC, LVS, and tape-out.



Chicago Career Tech

• United States
• Civic and Social Organizations
• 1 - 100 Employee

• Participant

  • Oct 2010 - Dec 2010

  Project Management training at DeVry. Enterprise Based Learning at Northern Trust Bank. Project Management training at DeVry. Enterprise Based Learning at Northern Trust Bank.



Circuit Layout Contractor

• RFIC and PCB Layout Specialist

  • Nov 2008 - Oct 2010

  Radio Frequency Integrated Circuit (RFIC) layout specialist, Printed Circuit Board (PCB) layout specialist, Manager of Substrate Layout teams. Radio Frequency Integrated Circuit (RFIC) layout specialist, Printed Circuit Board (PCB) layout specialist, Manager of Substrate Layout teams.

• Layout Engineer - Semiconductors, PCB's

  • Feb 2003 - Nov 2008

  Layout of mixed mode RFIC circuits in UltraCMOS process (silicon on sapphire) 0.5 and 0.25 micron technologies. Designed for bond wires, bump pads and thermal bump posts, and created bond wire drawings using Carsem and Unisem packaging. Also designed printed circuit boards for IC testing. CAD tools used included Cadence, PADS, and Orcad. Layout of mixed mode RFIC circuits in UltraCMOS process (silicon on sapphire) 0.5 and 0.25 micron technologies. Designed for bond wires, bump pads and thermal bump posts, and created bond wire drawings using Carsem and Unisem packaging. Also designed printed circuit boards for IC testing. CAD tools used included Cadence, PADS, and Orcad.



Motorola

• 1 - 100 Employee

• Integrated Circuit Designer, Group Leader Engineering Systems, Printed Circuit Design Team Leader

  • Jun 1988 - Feb 2002

  Designed printed circuit boards (PCB) for Ford engine controllers for the Automotive and Industrial Electronics Group (AIEG), managed team of six PCB designers, managed team of CAD library specialists and helped transition the engineering community to Mentor V8 EDA tools, designed custom analog/mixed-signal Integrated Circuits (IC) for AIEG and the Wireless Communications Group. Designed printed circuit boards (PCB) for Ford engine controllers for the Automotive and Industrial Electronics Group (AIEG), managed team of six PCB designers, managed team of CAD library specialists and helped transition the engineering community to Mentor V8 EDA tools, designed custom analog/mixed-signal Integrated Circuits (IC) for AIEG and the Wireless Communications Group.