Chipbond Technology Corporation. Logo

Chipbond Technology Corporation.

Locations: 力行五路3號 新竹市東區科學園區, 300, TW

Company Size: 100 - 200

Industry: Appliances, Electrical, and Electronics Manufacturing

Company Website

AI Description

drawer
  • Tiffany Tang profile image

    Full Stack Developer at Chipbond Technology Corporation.

  • Kuo-Hui Lin profile image

    TD製程工程師、黃光製程工程師、蝕刻製程工程師

  • jean jiang profile image

    頎邦科技 CHIPBONDTechnology Officer

  • Mike Wang profile image

    頎邦科技 CHIPBOND 產品經理

  • Yi Chun Ke profile image

    Product Chief engineer

  • shielalyn milla profile image

    Factory Worker at 頎邦科技 CHIPBOND

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