Experience

Chipbond Technology Corporation.

• Taiwan
• Appliances, Electrical, and Electronics Manufacturing
• 100 - 200 Employee

• Product Chief Engineer

  • Jul 2015 - Present

  CHIPBOND Assembly Product Engineer (2015/07~Now about 7 years) Achievements: Cooperation with local/ abroad customers, like: America; Korea; China. Be in charge of COG/COF driver IC assnmbly process production. Leading-in Apple, Hauwai AMOLED cellphone driver IC to mass production. Also proceed process improvement projects, yield improvement projects and special projects. Job function: 1. Leading-in new customer 2. Leading-in new product 3. Project management 4. Plan mass production flow 5. Customer complaint service Show less



Unimicron

• Taiwan
• Appliances, Electrical, and Electronics Manufacturing
• 500 - 600 Employee

• 產品工程師

  • Jul 2012 - Apr 2015

  UMTC Product Integration Engineer (2012/08~2015/04 about 3 years) Achievements: Participate in new factory build up. Establish mass production process for Intel standard layer/ thinner layer/ high stack layer 3 types IC carrier product. Job function 1. Production preparation 2. Cross-functional communication management 3. Leading-in new product 4. Professional skill: 6 sigma GB certification. Using JMP tooling to analyze data. UMTC Product Integration Engineer (2012/08~2015/04 about 3 years) Achievements: Participate in new factory build up. Establish mass production process for Intel standard layer/ thinner layer/ high stack layer 3 types IC carrier product. Job function 1. Production preparation 2. Cross-functional communication management 3. Leading-in new product 4. Professional skill: 6 sigma GB certification. Using JMP tooling to analyze data.