Teikoku Taping System specializes in the design, development and manufacture of semiconductor equipment used for taping (“Haru”), de-taping (“Hagasu”) and handling (“Hakobu”) of wafers and panels. TTS is the leader in Dry Film Resist lamination, as well as the handling of thin wafers for back grind tape lamination, UV irradiation, removal and mounting to dicing tape on film frame. Headquarters and manufacturing are in Nagoya, Japan. Customer support for demos, process development, and field service are all based in our offices in Phoenix, AZ.
