JCET Group is a leading global semiconductor system integration packaging and test provider, offering a full range of turnkey services that include semiconductor package integration design and characterization、R&D、wafer probe、wafer bumping、package assembly、final test and drop shipment to vendors around the world. Our comprehensive portfolio covers a wide spectrum of semiconductor applications such as mobile, communication, compute, consumer, automotive and industry etc., through advanced wafer level packaging、2.5D/3D、System-in-Packaging、and reliable flip chip and wire bonding technologies. JCET Group has three R&D centers, six manufacturing locations in China、Singapore and Korea, and sales centers around the world, providing close technology collaboration and efficient supply-chain manufacturing to customers in China and around the world. Follow JCET on LinkedIn at https://www.linkedin.com/company/jcetgroup
