RAM Innovations provides R&D and manufacturing services to the semiconductor and electronics industries. We are experts in Heterogeneous PCB embedded die packaging (EDP), collaborating with partners at the leading edge of semiconductor development and have designed and manufactured a number of power conversion modules based on this technology. We also provide a range of other services including flip chip, die placement and bonding, chemical processing and plating as well as embedded power module design. We are a growing business and are continually looking for talented individuals to join our team. Please feel free to send a CV and message if you are interested in joining our team. If you are a recruitment agency please do not send us any CVs without agreeing terms first.
