Omniply makes it possible to create any thin film electronic device (such as sensors, displays, memory) on flexible substrates. By using a proprietary delamination technique, Omniply can create high performance electronic devices on flexible substrates without compromising device performance, or without changing the manufacturing infrastructure. This delamination technique makes the process not only cheaper, but also more simple and eco-friendly, compared to traditional delamination methods. In addition, it overcomes resolution and reliability limits associated with printed electronics by using traditional CMOS infrastructure for device fabrication. Recently funded by TandemLaunch, a world renown deep-tech incubator, Omniply is in the process of developing the first round of prototypes. Looking forward to making an impact in the flexible electronics industry!
