Overview

NHanced Semiconductors is pioneering the future of advanced chip packaging. Our deeply experienced team applies decades of semiconductor expertise to solve today’s most pressing challenges. Led by industry veteran Bob Patti, we are spearheading next-generation architectures. We wield cutting-edge processes like 3D stacking, 2.5D interposers, high density interconnect, and chiplets to deliver brilliant solutions. We call it Foundry 2.0. Whether you require interposers, 2.5D assembly, TSV insertion, 3D stacking, or mixed-material integration, we've got you covered. Our fabs provide in-house process R&D, prototype fabrication, and small- to mid-volume manufacturing. With more than 70 advanced materials to work with and strong industry partnerships, we make the future of chip packaging a reality. Contact us to bring your bold chip vision to life.