Experience

CAD-IT Consultants (Asia) Pte Ltd

• Singapore
• IT Services and IT Consulting
• 100 - 200 Employee

• Applications Engineer

  • Jul 2013 - Present

  Specialized in ANSYS simulation software (ANSYS FLUENT, Icepak, CFX, Mechanical etc), I provide software application and usage advice to my clients in various engineering streams. I am a certified WDA ACTA adult educator and have been conducting regular WDA training courses for software users. Besides, I assist clients in resolving technical queries for CFD in Singapore and SEA region and take on consulting project. Occasionally, I deliver technical seminar and workshop to promote CAE awareness and demonstrate software capability. Show less



Institute of Microelectronics

• Singapore
• Research Services
• 100 - 200 Employee

• Scientist

  • Aug 2011 - Jul 2013

  Serve as project leader for a public funded project to design, fabricate and characterize a package level thermal management solution for monolithic microwave integrated circuit (MMIC). My responsibility includes managing project progress, prototype (thermal test chip and cooling solution) design, fabrication and characterization. Besides, I am involved in the thermal simulation and characterization of electronic packages (2.5D silicon interposer, 3DIC, electronics hotspot, power electronics) for various industrial and academic projects. Various cooling technologies ranging from natural convection, forced convection, liquid cooling and phase change are investigated. In addition, I am seconded to a local SME (Hitachi Critical Facilities Protection Pte Ltd) through “Growing Enterprises through Technology Upgrade (GET-Up)” programme for 3 months to assist in their new product development and characterization. Show less



Intel Technology Sdn. Bhd.

• Penang, Malaysia

• Assembly Technology Development Engineer

  • Jun 2005 - Jul 2007

  The primary responsibility of my job was to develop a robust flip chip assembly process for the high volume manufacturing (HVM) of Intel next generation chipsets. During the course of service, I in charged of the capacitor attach, die attach, reflow, deflux and automated inspection modules for 2 critical Intel chipset platforms. My role and responsibility also includes DOE planning and execution, FMEA, 5M+E, SOP definition and SPC for process stability and control, Machine UPH improvement,next generation machine development and buy off. Show less