Experience

MFLEX

• United States
• Computers and Electronics Manufacturing
• 200 - 300 Employee

• R&D Engineer/Lab supervisor

  • May 2011 - Present

  - Reported to R&D director. - FPC new process feasibility studies and improvement, focus on wire bonding pad studies, low energy solder mask application test and new materials on photo-imageable coverlay application evaluation to simplify flex process, etc. - Lab management for analysis equipment and document preparation for customer visit or audit on TS16949/ISO18001 etc. - Supported to internal or external request for failure analysis and related arrangement, communicated with apparatus suppliers to develop analysis capabilities such on thermal analysis for polymer materials, FTIR library setup, SEM/EDS application skills, etc.. - Test project management to support FPC application engineers for test board build and solutions from design, materials selection, coordinate with process engineers for trouble shooting and improvement; Administrated incoming part delivery and quality controlled on test project from outside service. Show less



Celestica

• Canada
• Manufacturing
• 700 & Above Employee

• Quality Analyst

  • Jul 2005 - Apr 2011

  • Skill in lab equipment and technology such as SEM-EDS, DSC/TMA, Ion Chromatography, 2DX and ATC test etc. • Supported SQE/QE & ME for Prototype, mass run failure analysis; Engaged in raw PCB qualification analysis, solder joint/metal surface analysis on PCBA and failure mode studies. • In charged with suppliers to develop analysis capabilities. • Reported to Asia lab manager. Participated in important failure cases and suggestions. • Provided technical training for new members and technicians. Show less



Wus Printed Circuit (Kunshan) Co., Ltd

• China
• Appliances, Electrical, and Electronics Manufacturing
• 1 - 100 Employee

• QA Engineer

  • Jul 2002 - Jun 2005

  PCB process chemical analysis, incoming materials test and PCB reliability test/failure analysis. PCB process chemical analysis, incoming materials test and PCB reliability test/failure analysis.