Test Engineer

• May 2021 - Present

Manager, Cooled FPA Test

• Nov 2019 - Apr 2021

- Developed and adapted python scripts to automate electrical and optical process evaluation chip (PEC) data acquisition, reduction, and report generation - Built a multi-tab graphical user interface (GUI) to control the Cornerstone 260 Monochromator using python programming (PyQt5 package) - Validated test systems due for customer delivery and provided customer support - Coordinated lab facilities requests and lab equipment purchases - Developed and adapted python scripts to automate electrical and optical process evaluation chip (PEC) data acquisition, reduction, and report generation - Built a multi-tab graphical user interface (GUI) to control the Cornerstone 260 Monochromator using python programming (PyQt5 package) - Validated test systems due for customer delivery and provided customer support - Coordinated lab facilities requests and lab equipment purchases

FPA Test Engineer

• Dec 2016 - Nov 2019

- Tested over 200 devices – group II-VI Infrared (IR) Focal Plane Arrays (FPAs – H1RG, H2RG, H4RG-15 formats), SIDECAR ASICs (SMds, CryoASICs), cables, and other related electronics for ground-based and space-based astronomy programs to meet internal and external customer delivery dates - Overcame major scheduling and technical obstacles to provide superior customer service to the MAJIS program by performing nine cryoboard resistance tests (15+ hours long) for the critical design (CDR) meeting and helped develop “striped mode” data acquisition to test MAJIS FPAs for the test readiness (TRR) meeting - Increased personal test throughput by nearly 2x from 34 devices in 2017 (7 H4RG-15, 20 SCEs, 7 GBA) to 60 devices in 2018 (12 H4RG-15/ESO/Moons, 22 GBA, 20 MAJIS, 6 Other) to accomplish contract commitments which ensured program success - Loaded infrared Focal Plane Arrays (FPAs) and Sidecar ASICs into liquid nitrogen, recirculated helium, and thermoelectric cooler Dewars - Operated infrared sensors, Sidecar ASICs, and sensor electronics for astronomy applications – 1K x 1K, 2K x 2K, and 4K x 4K sensors - Tested infrared FPAs for astronomy applications – dark current and optical testing - Ran in-house developed Interactive Data Language (IDL) data acquisition software - Analyzed and performed data reduction - Wrote test reports - Answered customer technical questions - Troubleshot sensors, electronics, and test setups - Used knowledge of vacuum and cryogenic systems - Followed electrostatic discharge (ESD) protocols and handling procedures - Wrote a Dewar loading procedure - Created a graphical user interface (GUI) using IDL programming to manipulate data files to generate properly formatted test reports - Wrote an IDL program to populate a test report database with test reports - Performed IDL programming to generate test reports, reduce data, and wrote functions to interact for MS Word Show less

Senior Development Engineer

• Nov 2016 - Dec 2016

Development Engineer

• Aug 2013 - Nov 2016

• Fabricated group III-V infrared (IR) focal plane arrays (FPAs)- Hybridized FPAs via flip chip bonding of various detector materials and silicon Readout Integrated Circuits (ROICs) (SET FC300 High Precision Die / Flip Chip Bonder)- Prepared metal interconnects with wet chemical etching prior to hybridization- Cleaned and inspected dies prior to hybridization - Performed experiments to evaluate key hybridization parameters - Hybridized numerous detector formats• Responsible for anti-reflection (AR) coating effort - Modeled visible and midwave IR broadband thin film AR coatings using TFCalc software- Deposited AR coatings using a CHA Ebeam evaporator and maintained evaporator- Wrote a process instructions for Ebeam evaporator operation and TFCalc modeling - Prepared weekly Powerpoint progress reports• Backend Processing and Test- Performed back end of line processes to increase reliability of hybridized FPAs- Performed back end process experiments for particular detector formats- Performed epoxy underfilling experiments for particular detector formats- Packaged various hybridized FPAs- Supported the operation and maintenance of the Hesse Mechatronics Bondjet BJ820 - Wrote a standard operating procedure for the Hesse Mechatronics Bondjet BJ820- Performed electrical characterization of FPAs via pixel connectivity and dark current testing• Inspection, Documentation, and Management- Used scanning electron microscopy to inspect test pieces (Hitachi S-4800 Field Emission Scanning Electron Microscope)- Inspected test wafers (Nikon Eclipse Nomarski Microscope and Keyence VK-X120 Laser Microscope)- Exposure to MatLab and Excel Macros (VBA); proficient in Excel, Powerpoint, and Word- Analyzed data from experiments, generated data visualizations, and prepared experiment summaries- Kept various logs and other paperwork up-to-date- Modified and maintained travelers for common processes- Directed other colleagues in the group to accomplish larger tasks Show less

Graduate Research Assistant

• Jun 2011 - Jul 2013

Project: An investigation of Radiation Effects on Quantum Dot enhanced Gallium Arsenide using Deep Level Transient Spectroscopy- Supervisors (co-PIs): Dr. Seth M. Hubbard and Dr. David V. Forbes- Characterized gallium arsenide schottky and pn-junction diodes using deep leveltransient spectroscopy, capacitance-voltage and current-voltage measurements,and optical microscopy- Familiar with radiation induced defects in gallium arsenide- Processed gallium arsenide wafers in the Semiconductor & Microsystems FabricationLaboratory, a cleanroom, at the Rochester Institute of Technology by performingwafer cleaning, spinning, exposing, and developing photoresist, physicalvapor depositions, and wet chemical etches- Designed a multilevel photolithographic mask using L-Edit software- Designed test structures in terms of intentional doping concentrations using simplemodelling- Analyzed data from experiments and prepared data visualizations- Used OriginPro, FileMaker Pro, LabView, LaTex, and MS Office software- Trained two graduate students; mentored three undergraduate students- Published a paper on my work, wrote technical reports on progress and attended project update meetings Show less

Undergraduate Researcher

• Mar 2009 - May 2011

Capstone Project: Response of Flammable Analytes investigated via Zinc Oxide Gas Sensors- Supervisor (PI): Dr. Seth M. Hubbard- Characterized gas sensors in terms of sensitivity using zinc oxide as the reactivefilm using various techniques - Made gas sensors from drop casting zinc oxide nanoplatelets on inter-digitated electrodes and fabricated metal contacts on zinc oxide thin films in the cleanroom at R.I.T. - Analyzed data from experiments and prepared data visualizations -- Wrote a capstone paper in a technical paper format-- Attended project update meetingsProject: Electrical and Optical Characterization of Zinc Oxide Thin Films- Supervisor (PI): Dr. Seth M. Hubbard- Characterized zinc oxide thin films deposited on glass slides using various techniques - Fabricated metal contacts on zinc oxide thin films in the cleanroom at R.I.T.- Sputtered gold onto test samples for scanning electron microscopy - Designed a multilevel photolithographic mask using L-Edit software- Analyzed data from experiments and prepared data visualizations - Attended project update meetings Show less

Graduate Student Senator

• Sep 2011 - Jul 2012

- Liaison between the graduate student body and Student Government - Revived the Cricket Club (Sport) and started Cricket Intramurals - Served on various committees such as Institute Council, Graduate Council, Graduate Student Advisory Committee, and Plus/Minus Grading Committee - Finance Chair of the Fourth Annual Graduate Research and Creativity Symposium at RIT - Worked events hosted by Student Government - Responsible for attending and contributing to weekly meetings, and completing assigned tasks for Student Government, Senator, and various committee meetings Show less

Production Associate

• Jun 2008 - Aug 2008

- Assembled power tool triggers - Bonded wires to switches for automovtives - Inspected switches for defects - Packaged products - Tested automotive key fob ignitions - Assembled power tool triggers - Bonded wires to switches for automovtives - Inspected switches for defects - Packaged products - Tested automotive key fob ignitions