Wonmo Yang

HW Engineer at FADU
  • Claim this Profile
Contact Information
us****@****om
(386) 825-5501
Location
South Korea, KR
Languages
  • English Limited working proficiency
  • Japanese Professional working proficiency

Topline Score

Topline score feature will be out soon.

Bio

Generated by
Topline AI

You need to have a working account to view this content.
Join now
You need to have a working account to view this content.
Join now

Credentials

  • Engineer Radio Telecommunication Equipment
    Korea Communications Agency (KCA)

Experience

  • FADU
    • South Korea
    • Semiconductor Manufacturing
    • 1 - 100 Employee
    • HW Engineer
      • Nov 2018 - Present

  • Daeduck Electronics
    • South Korea
    • Semiconductor Manufacturing
    • 1 - 100 Employee
    • Research Engineer
      • Feb 2007 - Oct 2018

      New Product Development - CoolFlex Memory Module (2007~2008) > fine pattern and thin substrate > high reliability flexible material - Metal PCB for LED TV BLU (2009~2011) > thermal simulation according to pcb specification > bonding technique for multi-layer metal pcb - Paste Via Filling to replace cu plating (2012~2013) > sintering type paste test > single lamination process w/o sequential process - High Current PCB for Automotive… Show more New Product Development - CoolFlex Memory Module (2007~2008) > fine pattern and thin substrate > high reliability flexible material - Metal PCB for LED TV BLU (2009~2011) > thermal simulation according to pcb specification > bonding technique for multi-layer metal pcb - Paste Via Filling to replace cu plating (2012~2013) > sintering type paste test > single lamination process w/o sequential process - High Current PCB for Automotive (2014~2016) > ion-migration suppression method > bus bar pcb integrated thick cu - Board level signal integrity for 5G (2017~2018) > high frequency material and pcb structure > Rigid-Flex pcb for 5G Antenna in package > Flex pcb instead of coaxial cable Patent - registration : 8 - application : 4 Others - UL authentication - electronics teardown Show less New Product Development - CoolFlex Memory Module (2007~2008) > fine pattern and thin substrate > high reliability flexible material - Metal PCB for LED TV BLU (2009~2011) > thermal simulation according to pcb specification > bonding technique for multi-layer metal pcb - Paste Via Filling to replace cu plating (2012~2013) > sintering type paste test > single lamination process w/o sequential process - High Current PCB for Automotive… Show more New Product Development - CoolFlex Memory Module (2007~2008) > fine pattern and thin substrate > high reliability flexible material - Metal PCB for LED TV BLU (2009~2011) > thermal simulation according to pcb specification > bonding technique for multi-layer metal pcb - Paste Via Filling to replace cu plating (2012~2013) > sintering type paste test > single lamination process w/o sequential process - High Current PCB for Automotive (2014~2016) > ion-migration suppression method > bus bar pcb integrated thick cu - Board level signal integrity for 5G (2017~2018) > high frequency material and pcb structure > Rigid-Flex pcb for 5G Antenna in package > Flex pcb instead of coaxial cable Patent - registration : 8 - application : 4 Others - UL authentication - electronics teardown Show less

Education

  • Ajou University(아주대학교)
    Ph.D, electrical and computer engineering
    2014 - 2021
  • Ajou University(아주대학교)
    MS, telecommunication engineering
    2004 - 2007
  • 단국대학교
    BS, electronic engineering
    2000 - 2004

Community

You need to have a working account to view this content. Click here to join now