Wim Huiskamp
Process Engineer at Nedstack Fuel Cell Technology- Claim this Profile
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English Professional working proficiency
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German Limited working proficiency
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French Elementary proficiency
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Dutch Native or bilingual proficiency
Topline Score
Bio
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Experience
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Nedstack Fuel Cell Technology
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Netherlands
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Renewable Energy Equipment Manufacturing
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1 - 100 Employee
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Process Engineer
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Apr 2021 - Present
Process optimization and industrialisation of PEM Fuel Cell. Investigation of process steps involving yield of cell plate manufactering incl using DoE's. Optimization of compounding process include milling of carbon black and investigation of powder conveying and distribution using particle size distribution techniques. Teamwork relevant and assist in validation of presses for compression molding. Process optimization and industrialisation of PEM Fuel Cell. Investigation of process steps involving yield of cell plate manufactering incl using DoE's. Optimization of compounding process include milling of carbon black and investigation of powder conveying and distribution using particle size distribution techniques. Teamwork relevant and assist in validation of presses for compression molding.
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MSD Nederland
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Netherlands
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Pharmaceutical Manufacturing
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500 - 600 Employee
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Process Engineer
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Oct 2012 - Mar 2021
Initiate sub projects in Lyospheres technology /Freeze drying process lead and development (include DoE's)/qualification (DQ/ SAT/IOQ/PQ) of equipment. Precise dosing and freezing liquids. Black belt certified. Projects in polymeric group (tyvek change/ cleaning/ in vitro release API for qualification of polymers, welding of polymers). Initiate sub projects in Lyospheres technology /Freeze drying process lead and development (include DoE's)/qualification (DQ/ SAT/IOQ/PQ) of equipment. Precise dosing and freezing liquids. Black belt certified. Projects in polymeric group (tyvek change/ cleaning/ in vitro release API for qualification of polymers, welding of polymers).
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Philips
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Netherlands
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Hospitals and Health Care
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700 & Above Employee
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Technologist
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Jun 2011 - Sep 2012
Electronic Packaging & Thin Film; Process development on a broad scale of devices using thin film proces technology include planarization/ bonding /interface technology. Electronic Packaging & Thin Film; Process development on a broad scale of devices using thin film proces technology include planarization/ bonding /interface technology.
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sr. process engineer
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Feb 2009 - May 2011
Optimisation/ implementation of parentherale production processes improvements e.g. aseptic connection, in-line filtering, leachables of materials. Optimisation of filling volume parameters, oxygen reduction in vials & Black Belt certified on release of automatic inspection machine for vials using DoE's Optimisation/ implementation of parentherale production processes improvements e.g. aseptic connection, in-line filtering, leachables of materials. Optimisation of filling volume parameters, oxygen reduction in vials & Black Belt certified on release of automatic inspection machine for vials using DoE's
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NXP Semiconductors
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Netherlands
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Semiconductor Manufacturing
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700 & Above Employee
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sr. process engineer
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Oct 2004 - Jan 2009
thin film deposition related to BAW development, AlN deposition and related k-factor distribution, uniform PVD deposition (Pt Ta2O5). Interactions to electrical perfomance of BAW devices (Green Belt) thin film deposition related to BAW development, AlN deposition and related k-factor distribution, uniform PVD deposition (Pt Ta2O5). Interactions to electrical perfomance of BAW devices (Green Belt)
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Philips Semiconductors
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United States
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Business Consulting and Services
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1 - 100 Employee
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engineer thin film/ electroplating /wet process
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Mar 1995 - Sep 2004
Optimization and implementation of processes based on lpcvd /electroplating/ cleaning / etching. Release of new equipment include technology transfer to production.
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engineer LPCVD/ contamination analyses
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Mar 1990 - Feb 1995
Development of new flow glass layers based on lpcvd. Contimination investigation at Si surface and bulk analyses (gettering / dlts/min carrier lifetime).
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engineer Q&R/ elctromigration/ gate oxide
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Sep 1987 - Feb 1990
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Education
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Saxion University of Applied Sciences
BSc, Chemical technology -
MTS Hengelo (Ov)
Polytechnical, Electronics