Wang Jin-Yi

Senior, IC package Process & manufacture Engineer at QUALCOMM TECHNOLOGIES INTERNATIONAL, LTD.
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Contact Information
us****@****om
(386) 825-5501
Location
Taiwan, TW
Languages
  • English Full professional proficiency
  • Chinese Native or bilingual proficiency
Skills

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Credentials

  • TOEFL
    ETS Global B.V.
    Feb, 2016
    - Oct, 2024

Experience

  • QUALCOMM TECHNOLOGIES INTERNATIONAL, LTD.
    • United Kingdom
    • Appliances, Electrical, and Electronics Manufacturing
    • 100 - 200 Employee
    • Senior, IC package Process & manufacture Engineer
      • Dec 2021 - Present
  • S-group of Foxconn
    • Subcon managemt, section manager
      • Aug 2021 - Dec 2021
  • 群聯電子 PHISON Electronics
    • Taiwan
    • Semiconductor Manufacturing
    • 200 - 300 Employee
    • SQE, senior engineer
      • Jul 2017 - Aug 2021

      As a Senior IC & supplier quality Engineer As a Senior IC & supplier quality Engineer

  • 華邦電子股份有限公司
    • SQE, senior engineer
      • May 2016 - Jun 2017
  • SPIL
    • Semiconductor Manufacturing
    • 300 - 400 Employee
    • Integrated Process Engineer
      • Aug 2012 - Sep 2015

      * BOM List create and review * To assess TRA report and host a kick-0ff meeting with all assembly teams *Well know Flip chip key process and solder ball interaction * To lead process engineer to solve project issue * To host Qualcomm device NPI project * Well know Failure analysis item and theroy * To build Contrrol Plan and device FMEA in new project. *2015 May~ Sept., SPIL NPI flow standardization group- FCCSP member 1. To define NPI action and NPI flow for all SPIL business unit standard 2. NPI experiences shared and fan-out to other Business Uint. 3. To define PDA/IPP criteria with substrate vendor. Show less

  • Siliconware Precision Industries
    • Semiconductor Manufacturing
    • 1 - 100 Employee
    • R &D Engineer
      • Sep 2012 - Feb 2013

      1.Analysis Flux and solder ball material character and the reaction 2.To Assess phase-in Qualcomm's product in SPIL, I in charge the process of solder ball placement 3.To define the doping element which is anti-oxidation criteria in solder ball in SPIL. 4. To develop new techiquic of TCFC (thermal compression flip chip) 5. To study the reaction between solder bump with different composition the bump's stress profile 1.Analysis Flux and solder ball material character and the reaction 2.To Assess phase-in Qualcomm's product in SPIL, I in charge the process of solder ball placement 3.To define the doping element which is anti-oxidation criteria in solder ball in SPIL. 4. To develop new techiquic of TCFC (thermal compression flip chip) 5. To study the reaction between solder bump with different composition the bump's stress profile

  • Taita Chemical Company
    • Ｃhemical Engineer
      • Jun 2000 - Sep 2000

Education

  • National Chung Hsing University
    Master's degree, Chemical Engineering
    2010 - 2012

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