Experience

ICEpower Audio

• Denmark
• Appliances, Electrical, and Electronics Manufacturing
• 1 - 100 Employee

• Head of Department, R&D Digital Hardware

  • Sep 2021 - Present

• Tech Lead, R&D Digital Hardware

  • Mar 2021 - Sep 2021



Trackman

• Denmark
• Spectator Sports
• 400 - 500 Employee

• Tech Lead & Hardware Developer

  • Aug 2017 - Mar 2021

  Position: Project Manager for +10 people: +2 years Department: R&D Task: Product responsible together with Product Owner. Management of Team: Mixed digital/analog hardware, eSW, algorithm, vision, EMS. Position: Tech/team lead and Hardware R&D Engineer: 1.5 years Department: R&D Task: Develop Hardware platform, used in multi-product cross spots, including system design. Key components: Ethernet switch 1G, PTP 1588v2, SFP 1000base-T, PoE, USB 3.0. COM Express type 6 carrier for Intel x86 core, mSATA, mPCIe, USB3.1 + GPS/RTK and Atmel MCU devices. Show less



EMC (Expanding Mobile Connectivity)

• United States
• Telecommunications
• 1 - 100 Employee

• R&D Development Engineer

  • Mar 2015 - Aug 2017

  Position: Hardware Manager and R&D Engineer 50/50 Department: R&D Design/debug/verification/ of Digital Hardware used in VSAT Modem/HUB Key components: Freescale CPU, DDR2/3, Ethernet 100/1000Mbit, DAC/ADC, Virtex7/5 VHDL implementation PCIe2/3 IP Core and Serdes(SRIO)Transceivers Support for an EMS located in Thailand Position: Hardware Manager and R&D Engineer 50/50 Department: R&D Design/debug/verification/ of Digital Hardware used in VSAT Modem/HUB Key components: Freescale CPU, DDR2/3, Ethernet 100/1000Mbit, DAC/ADC, Virtex7/5 VHDL implementation PCIe2/3 IP Core and Serdes(SRIO)Transceivers Support for an EMS located in Thailand



Cobham Satcom

• Denmark
• Telecommunications
• 400 - 500 Employee

• R&D Engineer

  • Mar 2002 - Feb 2015

  Position: R&D Engineer 12 years / HW team lead 1 year Department: R&D Design/debug/verification/documentations of Digital Hardware for BGAN L-Band satellite terminal for: Marine, Aero and Landmobile Key components: ASIC’s, TI CPU/DSP, SDRAM, LPDDR, DDR2/3, Flash, Xilinx FPGAs, 2W, ISDN, USIM, Ethernet, WLAN, USB, CAN, Arinc. VHDL implementation: Control units, low level HW I/O drivers Position: R&D Engineer 12 years / HW team lead 1 year Department: R&D Design/debug/verification/documentations of Digital Hardware for BGAN L-Band satellite terminal for: Marine, Aero and Landmobile Key components: ASIC’s, TI CPU/DSP, SDRAM, LPDDR, DDR2/3, Flash, Xilinx FPGAs, 2W, ISDN, USIM, Ethernet, WLAN, USB, CAN, Arinc. VHDL implementation: Control units, low level HW I/O drivers



Bang & Olufsen

• Denmark
• Computers and Electronics Manufacturing
• 700 & Above Employee

• R&D Engineer

  • Mar 2001 - Feb 2002

  Position: R&D Engineer Department: Technology Development Design/ verification of Digital Hardware for Digital PMA platform. Key components: DSP, FPGA, Flash, Sample Rate Converter, Over Sampler, SPDIF/AES3 IF. Matlab algorithm C programming of Analog Devices DSP VHDL programming of Xilinx FPGA. Position: R&D Engineer Department: Technology Development Design/ verification of Digital Hardware for Digital PMA platform. Key components: DSP, FPGA, Flash, Sample Rate Converter, Over Sampler, SPDIF/AES3 IF. Matlab algorithm C programming of Analog Devices DSP VHDL programming of Xilinx FPGA.