Experience

ASE Group Global

• Taiwan
• Semiconductor Manufacturing
• 100 - 200 Employee

• Equipment Maintenance Engineer

  • Aug 2014 - Present

  -Functions as a Maintenance and Improvement Engineer, for the Bumping Process, in thePick and Place, and Handler Tester of semiconductor devices from different customers.-Helped establish setup and conversion procedures for Pick and place Mi20/Mi30 machines.-Responsible for device set-up and qualification as per process requirement -Coordinates and Performs various technical duties associated with repair, troubleshooting, maintenance, upgrade and calibration of equipments used in Tape and Reel.-Converts machine parts required for different devices (eg. Wafer table, Tape Track, Pick-up Head etc.), -Performs weekly Equipment Preventive Maintenance and Calibration (Mi20 and Mi30 Machine).- Generate and maintain Pick and Place system specification and engineering documentation.- Monitors MTBF (Mean Time between Failures) & MTTR (Mean Time to Repair). Knows engineering indicators/terminologies (i.e. Availability, Yield, downtime, Uptime, MTBF, OEE, MTTR, MTBA, Efficiency, Utilization among others) and use and understand basic statistics, quality tools, SPC, MSA and structured problem solving.



Texas Instruments

• United States
• Semiconductor Manufacturing
• 700 & Above Employee

• Equipment Maintenance Engineer

  • Apr 2010 - Aug 2014

  Equipment Maintenance Engineer in the following Stations: COPPER PILLAR,FLIP CHIP,and DIE BOND-Functioned as Shift Leader Engineer.-Performs Periodic Equipment Preventive Maintenance and Calibration (PROTEC & TORAY)-Updates Periodic PM schedule through CMMS3database-Responsible for device set-up and qualifications as per process requirement-Coordinates and Performs various technical duties associated with repair, troubleshooting, maintenance, upgrade and calibration of equipments used in Copper Pillar.-Converts machine parts required for different devices (eg. Bonder Stage, Attachment Tool, etc.), cleaning augers, program generation and set-up (eg. weight, offset and placement control).-Does Stage Profiling on Toray machines-Performs quarterly calibrations in all CGM (continuous grounding monitor) in CopperPillar Area. Functionality check, replacement of worn-out parts.- Monitors MTBF (Mean Time between Failures) & MTTR (Mean Time to Repair). Knows engineering indicators/terminologies (i.e. Availability, Yield, downtime, Uptime, MTBF, OEE, MTTR, MTBA, Efficiency, Utilization among others) and use and understand basic statistics, quality tools, SPC, MSA and structured problem solving.



Contaq Masters Inc. (Subcon /Texas Instrument Philippines Inc.)

• Industrial Technician

  • Jun 2008 - Oct 2008

  -Perform Device Set-up and Qualification as per Process requirement (eg. MC Parameters)-Does Equipment Repair,Troubleshooting, and various technical duties associated with maintenance, upgrade and calibration of equipments used in assembly Prebond area.-Does Equipment Conversion and Set-up for different devices (eg. Stage Chuck, Loaders, wafer loader, etc.). -Perform Device Set-up and Qualification as per Process requirement (eg. MC Parameters)-Does Equipment Repair,Troubleshooting, and various technical duties associated with maintenance, upgrade and calibration of equipments used in assembly Prebond area.-Does Equipment Conversion and Set-up for different devices (eg. Stage Chuck, Loaders, wafer loader, etc.).



Texas Instruments

• United States
• Semiconductor Manufacturing
• 700 & Above Employee

• Industrial Technician

  • Jan 2008 - Jun 2008

  -Perform Device Set-up and Qualification as per Process requirement (eg. MC Parameters)-Does Equipment Repair,Troubleshooting, and various technical duties associated with maintenance, upgrade and calibration of equipments used in assembly Prebond area.-Does Equipment Conversion and Set-up for different devices (eg. Stage Chuck, Loaders, wafer loader, etc.). -Perform Device Set-up and Qualification as per Process requirement (eg. MC Parameters)-Does Equipment Repair,Troubleshooting, and various technical duties associated with maintenance, upgrade and calibration of equipments used in assembly Prebond area.-Does Equipment Conversion and Set-up for different devices (eg. Stage Chuck, Loaders, wafer loader, etc.).