TIEN JEN SHIH
設備技術工程師 at 矽品精密工業股份有限公司- Claim this Profile
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中文 Native or bilingual proficiency
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英文 Elementary proficiency
Topline Score
Bio
Experience
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SPIL 矽品
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Taiwan
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Semiconductor Manufacturing
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200 - 300 Employee
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設備技術工程師
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Oct 2022 - Present
(1)ECM(改善)-標準攻堅-改/換/保養項目合理化及時間精進 (2)MP-線上問題解決-線上問題及提供解決方案 (3)ECM(改善)-標準攻堅-產出改/換/保養項目標準 (1)ECM(改善)-標準攻堅-改/換/保養項目合理化及時間精進 (2)MP-線上問題解決-線上問題及提供解決方案 (3)ECM(改善)-標準攻堅-產出改/換/保養項目標準
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AUO
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Taiwan
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Appliances, Electrical, and Electronics Manufacturing
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700 & Above Employee
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製程設備工程師
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Feb 2022 - Aug 2022
黃光Track 製程 1.製程改良與良率提昇 2.生產效能及成本效益之提昇 3.設備故障排除、例行性維護保養及清潔 4.設備改善執行資格要求 黃光Track 製程 1.製程改良與良率提昇 2.生產效能及成本效益之提昇 3.設備故障排除、例行性維護保養及清潔 4.設備改善執行資格要求
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住華科技
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台灣 臺中市 后里區
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製程設備工程師
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Oct 2021 - Feb 2022
1.RTP設備維護、保養 2.部品管理、備品請購 3.產品異常調查、recipe參數調整 1.RTP設備維護、保養 2.部品管理、備品請購 3.產品異常調查、recipe參數調整
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SPIL 矽品
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Taiwan
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Semiconductor Manufacturing
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200 - 300 Employee
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Equipment Engineer
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Aug 2009 - Jul 2021
Die Bond Process 1. Equipment maintenance and inspection to maintain the normal operation of the equipment 2. Abnormal data collection, analysis and improvement to improve machine functions 3. General maintenance of equipment 4. Establish/adjust/verify the operating parameters and parameter file management of the new model Die Bond Process 1. Equipment maintenance and inspection to maintain the normal operation of the equipment 2. Abnormal data collection, analysis and improvement to improve machine functions 3. General maintenance of equipment 4. Establish/adjust/verify the operating parameters and parameter file management of the new model
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Education
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2017 - 2019
National Formosa University
碩士, 光電工程研究所
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