Sushma Madduri, PhD
Associate Professor, Mechanical Engineering Technology Department at SUNY Broome Community College- Claim this Profile
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English -
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Telugu -
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Hindi -
Topline Score
Bio
Credentials
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Proposal Reviewer Plus 2023
EDUCAUSEJun, 2023- Oct, 2024 -
Brightspace Fundamentals Training Course
SUNY Center for Professional DevelopmentNov, 2022- Oct, 2024 -
Proposal Reviewer 2022
EDUCAUSEJun, 2022- Oct, 2024 -
Proposal Reviewer 2022
EDUCAUSEJun, 2022- Oct, 2024 -
Proposal Reviewer 2021
EDUCAUSEJun, 2021- Oct, 2024 -
SUNY Online Summit
SUNY OnlineApr, 2021- Oct, 2024 -
Introduction to Psychology
CourseraJan, 2021- Oct, 2024 -
ASU GSV Virtual Summit 2020
ASU GSV SummitOct, 2020- Oct, 2024 -
Proposal Reviewer 2020
EDUCAUSEJul, 2020- Oct, 2024 -
Proposal Reviewer 2019
EDUCAUSEJun, 2019- Oct, 2024 -
Proposal Reviewer Plus 2018
EDUCAUSEMay, 2018- Oct, 2024
Experience
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SUNY Broome Community College
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United States
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Higher Education
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400 - 500 Employee
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Associate Professor, Mechanical Engineering Technology Department
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May 2023 - Present
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Assistant Professor, Mechanical Engineering Technology Department
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Jan 2019 - May 2023
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Adjunct Faculty, Engineering Science and Physics Department
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Sep 2013 - Dec 2018
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Binghamton University
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Higher Education
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700 & Above Employee
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Research Support Analyst, Information Technology Services
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Aug 2017 - Jan 2019
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State University of New York Cortland
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United States
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Higher Education
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700 & Above Employee
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Visiting Assistant Professor, Physics Department
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Jul 2016 - May 2017
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Binghamton University
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Higher Education
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700 & Above Employee
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Adjunct Faculty, Mechanical Engineering Department
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May 2013 - May 2014
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Corning Incorporated
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United States
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Glass, Ceramics and Concrete Manufacturing
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700 & Above Employee
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Graduate Research Assistant
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Jun 2007 - Jun 2009
Failure mechanism and reliability analysis on electronic packaging applications, consumer electronics, non-hermetic optoelectronic packages Failure mechanisms identification -FMEA Materials evaluation for use in packages - hygroscopic swelling, moisture exposure/condensation testing Package performance studies - accelerated testing Numerical modeling and finite element simulations - stress analysis Customer Feedback Failure mechanism and reliability analysis on electronic packaging applications, consumer electronics, non-hermetic optoelectronic packages Failure mechanisms identification -FMEA Materials evaluation for use in packages - hygroscopic swelling, moisture exposure/condensation testing Package performance studies - accelerated testing Numerical modeling and finite element simulations - stress analysis Customer Feedback
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Education
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State University of New York at Binghamton
PhD, Mechanical Engineering -
University of Cincinnati
MS, Mechanical Engineering -
Muffakham Jah College of Engineering & Technology
Bachelor of Engineering - BE, Mechanical Engineering