Experience

QUALCOMM TECHNOLOGIES INTERNATIONAL, LTD.

• United Kingdom
• Appliances, Electrical, and Electronics Manufacturing
• 100 - 200 Employee

• Staff Engineer, SERDES

  • Nov 2021 - Present

• Senior Engineer, SERDES

  • Jun 2018 - Dec 2021



Tyndall National Institute

• Ireland
• Research Services
• 200 - 300 Employee

• PHD Student

  • Jan 2014 - Dec 2020

  Analog Design for high speed short reach optical interconnects, PAM4 front-end design at 40 Gbps in CMOS 65nm and NRZ design in SiGe BiCMOS 130nm. Focus on receiving front-end (transimpedance amplifier / VGA / CTLE / high speed output buffer) Analog Design for high speed short reach optical interconnects, PAM4 front-end design at 40 Gbps in CMOS 65nm and NRZ design in SiGe BiCMOS 130nm. Focus on receiving front-end (transimpedance amplifier / VGA / CTLE / high speed output buffer)



Ecole Polytechnique de Montreal

• Canada

• Intern

  • Mar 2013 - Aug 2013

  Comsol Multiphysics simulation of electrowetting on dielectric for Lab on Chip applications. Comsol Multiphysics simulation of electrowetting on dielectric for Lab on Chip applications.



EPFL

• Switzerland

• Design Engineer

  • Feb 2012 - Jan 2013

  Design of a mixed signal ultra low power integrated battery charger for solar energy harvesting applications in 0.18um CMOS technology to be used with Li-Ion batteries. Design of a heart rate monitor using pulsoximeter techniques for swimmers PCB/system level design. Design of a mixed signal ultra low power integrated battery charger for solar energy harvesting applications in 0.18um CMOS technology to be used with Li-Ion batteries. Design of a heart rate monitor using pulsoximeter techniques for swimmers PCB/system level design.



Lawrence Berkeley National Laboratory

• User

  • Jun 2011 - Sep 2011

  Summer Internship at Nanofabrication labs, research on nanofabrication of Nickel nanowires via template method for TEM characterization Summer Internship at Nanofabrication labs, research on nanofabrication of Nickel nanowires via template method for TEM characterization