Experience

SF Rak Company

• Business Consulting and Services
• 1 - 100 Employee

• Principal

  • Jan 2021 - Present

  Engaged in providing reliable, materials science and assembly solutions for electronic packaging design and manufacturing enterprises. Engaged in providing reliable, materials science and assembly solutions for electronic packaging design and manufacturing enterprises.



Continental

• Germany
• Motor Vehicle Manufacturing
• 700 & Above Employee

• Manufacturing Innovation, Technical Executive in Automotive Electronics Manufacturing

  • Oct 2016 - Jan 2021

  Worked across organizational lines to establish the strategy for the implementation of process (raw) materials into Manufacturing for the worldwide production of automotive electronic controls, multimedia, and safety devices. Managed a global team and laboratories for performing materials development, assembly, and test. Established materials processing & test labs in the Philippines. Developed the additive manufacturing / 3D Printing materials strategies for Production. Completed a Design for Six Sigma project for the development an automotive grade Underfill material. Worked globally with experts and specialists on materials / process development, and industrialization. Conducted complex problem solving and address broad-scope quality topics impacting the electronics design and manufacturing. Show less

• Manufacturing Technology, Head of Materials Technology at Continental Automotive GmbH

  • Oct 2012 - Sep 2016

  In Germany, served as the technical manager of electronic assembly materials strategy for global automotive electronics production. Provided leadership and directly responsible for supervising technical employees, technical projects, and department. Worked with 12 Business Units, 30 Plants, Quality, & Purchasing on material standardization strategies for common assembly materials and processes.

• Head of Materials Technology, Principal Technical Expert of Electronics Chemical Processes

  • Jul 2006 - Nov 2012

  Characterized and released into production electronics manufacturing assembly materials including PCB surface finishes, solder masks, solder pastes, fluxes, coatings & lacquers, adhesives, thermal interface materials, sealants, and underfill encapsulants. Standardized and strengthened materials specifications to reduce variability and improve production quality. Demonstrated material and process compatibility for new materials and defines material combinations to be used in Production for Conti's electronic products. Made recommendations for the most complex materials and process technologies to meet design and manufacturing requirements. Merged and provided manufacturing inputs for PCB delivery specifications and design guidelines. Worked with Manufacturing Engineering Teams on material standardization and acceptance. Drove innovation in manufacturing materials technology. Secured state of the art technology for Continental. Increased knowledge sharing through networking and cooperation with internal and external partners. Provided internal consulting services to Sr. management. Recognized as authority of novel solutions to problems in materials and process technologies. Show less



Motorola Mobility (a Lenovo Company)

• United States
• Computers and Electronics Manufacturing
• 700 & Above Employee

• Sr. Mgr., Materials & Process Technology; Distinguished Member of the Technical Staff

  • Dec 2001 - Jul 2006

  Managed materials engineering activities (11 people / $1.6M budget) for product design, product launch, production support, and advanced development. Products included engine and powertrain controls, telematics, autobody electronics, and pressure sensors. Qualified and standardized electronic packaging and manufacturing materials used by design teams & plants. Responsibilities included direct reports in the factories for process development. Supported 4 factories in 3 countries in addition to the business units. Chaired the Powertrain Patent Committee for 2-yrs. Show less

• Section Mgr., Materials & Process Technology; Principal Staff Engr.

  • Apr 2000 - Dec 2001

  Managed the Advanced Materials and the Applied Materials Technology Teams. Responsible for automotive controls advanced development and design support at the design center. Qualified PCB suppliers.

• Group Leader, Advanced Materials; Sr. Staff Engr.

  • Sep 1997 - Apr 2000

  Managed 5 people with a $540K/yr. budget to develop innovative material technologies for the electronic packaging of automotive controls. Responsible for the characterization and implementation of flexible and high density circuit board technologies. Reduced costs > $10M through technological advancements in flexible circuits, circuit board finishes, and dielectric gels. Implemented a VOC-free conformal coating at the production facilities to reduce solvent emissions and create a standard.

• Staff Scientist

  • Jun 1994 - Sep 1997

  Utilized thermal, analytical, and custom test methods including DSC, TGA, TMA, microdielectrometry, GC-MS, FT-IR, NMR, IC, and surface insulation resistance (SIR) to characterize electronic packaging materials for automotive electronic applications and high reliability requirements. Developed and implemented into production methods for heat-sinking organic and ceramic circuit substrates. Developed material specifications.

• Materials Specialist

  • Dec 1992 - Jun 1994

  Eliminated ozone-depleting solvents at 4 factories by qualifying CFC free coatings, adhesives, and no-clean solder fluxes for high-volume engine control manufacturing.

• Sr. Materials Engr.

  • Nov 1991 - Dec 1992

  Assisted Design Engineering Teams with material selection and characterization for engine control products.