Stanley Lin

Technical Program Manager at HTC VIVE
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TW

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Credentials

  • Digital Marketing Certigication
    Google
    Oct, 2022
    - Sep, 2024
  • Google Project Management: Specialization
    Coursera
    Aug, 2021
    - Sep, 2024
  • Google Analytics (分析) 個人認證
    Google
    Jul, 2022
    - Sep, 2024

Experience

    • Taiwan
    • Computers and Electronics Manufacturing
    • 200 - 300 Employee
    • Technical Program Manager
      • Feb 2016 - Present

      1. In house technology development:a. Lead a multi-function team to create innovative technologies for future VR/AR applications.b. Responsible for new technology introduction 2. Scouting new technology and plan a suitable proposal for next gen productsa. Find and analyze multi-filed tech for future productsb. Communicate with vendor or research unit to work out a collaboration modelc. Responsible for new technology introduction

    • Technical Program Manager
      • Feb 2016 - Jul 2022

    • Vietnam
    • Legal Services
    • R&D Manager
      • Mar 2012 - Feb 2016

      HTC studio is an innovation center which responds to develop the advanced technology for next generation product of company. We’ve defined and accomplished many key technologies in the world. Full product develop experience here start from new concept incubation-->project proposal-->define spec and evaluation-->prototype debug and verification-->introduce to HTC product-->mass production and quality management. Achievements: .Hybrid PA- The world’s first hybrid, multi-mode, multi-band power amplifier module: ( MP in HTC One SV, HTC New One M7 ) . RF AIO module - The world’s first and highly integrate RF module: ( MP in HTC Desire601)

    • Taiwan
    • Appliances, Electrical, and Electronics Manufacturing
    • 700 & Above Employee
    • Sr. Engineer
      • Aug 2008 - Feb 2012

      #Top 10 consumer electronic OEM company (2007 spin-off from BenQ) In charge of the world's first 5" phablet (Dell Streak) and 2 smart phones RF hardware design and verification. My responsibility contains: 1. Stack-up with ME and ID. 2. RF components survey and performance evaluation. 3. RF layout. 4. 2nd source survey and cost down planning. 5. Hardware function (GSM/WCDMA/LTE/BT/WiFi/NFC/GPS) verification and debugging 6. Factory test flow design. 7. CPK/NPI analysis and improvement for manufacture.

Education

  • Feng Chia University
    Master's degree, Electrical, Electronics and Communications Engineering
  • Yuan-Ze University
    Bachelor's degree, Electrical and Electronics Engineering

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