Siri R. Shastri-Arndt

System Integration And Test Engineer at ASM Assembly Systems
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Contact Information
us****@****om
(386) 825-5501
Location
Munich Area, Germany, DE
Languages
  • Kannada Native or bilingual proficiency
  • Tamil Native or bilingual proficiency
  • Hindi Limited working proficiency
  • German Professional working proficiency
  • English Full professional proficiency
Skills

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Experience

  • ASM Assembly Systems
    • Germany
    • Appliances, Electrical, and Electronics Manufacturing
    • 100 - 200 Employee
    • System Integration And Test Engineer
      • Nov 2017 - Present

  • Fraunhofer Institute for Silicon Technology ISIT
    • Germany
    • Semiconductors
    • 1 - 100 Employee
    • Master Thesis
      • May 2014 - May 2015

      PRINTING AND ENCAPSULATION PROCESSES FOR SI-CHIP ASSEMBLY AND CONTAINING IN AND ON FLEXIBLE SUBSTRATE:- Printed electronics (inkjet printing and screen printing) on flexible substrates- Hybrid electronics specifically Chip Scale Package (120µ-40µ)on flexible substrates- Test and analysis (optical microscopy, laser profilometry, electrical characterization- Die packaging techniques like flip chip - Encapsulation - Mechanical testing ( with the tensile strength test stand) and Electrical testing

  • Siemens
    • Germany
    • Automation Machinery Manufacturing
    • 700 & Above Employee
    • Internship
      • Aug 2013 - Sep 2013

      Basics in - Design of Logic Charts in SIMATIC S7 Industry Control system.- Implementation of HMI in SIMATIC WinCC and WinCC flexible System.

Education

  • Hochschule Bremen
    Master's degree, Instrumentation & measurements Engineering
    2013 - 2015
  • Malnad college of engineering Hassan
    Bachelor of Engineering (BE) in Instrumentation Technology, Measurements and instrumentation
    2008 - 2012

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