Experience

Integrated Service Technology Inc. (iST)

• Taiwan
• Semiconductor Manufacturing
• 1 - 100 Employee

• Director

  • Sep 2022 - Present

  Professional semiconductor failure analysis support/consultant and lab management

• Special Assistant

  • May 2022 - Sep 2022

  Reliability/ Material Analysis/ Failure Analysis service lab for semiconductor field



力晶積成電子製造股份有限公司

• 東區, 台灣

• 技術經理

  • Mar 2021 - Jul 2022

  FA consultant; customer engineering; Wafer-on-wafer technology development FA consultant; customer engineering; Wafer-on-wafer technology development



TSMC

• Taiwan
• Semiconductor Manufacturing
• 700 & Above Employee

• Section Manager

  • Jun 2016 - Mar 2021

  MEMS (motion sensor, pressure sensor, microphone, CMUTs, etc.), CMOS image sensor, optical diffractive element, Silicon product FASEM lab management

• Technical Manager

  • Jun 2014 - Jun 2016

  MEMS, CMOS image sensor FA, 2um~ 16nm CMOS Product FAFA lab management

• Principal Engineer

  • Jun 2008 - Jun 2014

  Failure analysis on silicon products, not only from mature to advanced technologies, but also new FA capability development in tsmc for LED, MEMS and CIS projectsLeader for FA lab technician management to enhance both capability and capacity in FA lab (23 technicians)

• Principal engineer

  • Mar 2005 - Jun 2008

  Failure analysis for package field, familiar with WLCSP, Flipchip, Wirebond technologies



Chipbond Technology Corporation.

• Taiwan
• Appliances, Electrical, and Electronics Manufacturing
• 100 - 200 Employee

• Senior Engineer

  • Oct 2004 - Mar 2005

  Process integration engineering for gold bump/ solder bump process Process integration engineering for gold bump/ solder bump process