Experience

Raytheon

• United States
• Defense and Space Manufacturing
• 700 & Above Employee

• Product Engineering Manager

  • Oct 2018 - Present

  • Manage product engineers (technical project manager) responsible for cost, schedule and technical requirements of sensor chip assembly (SCA) fabrication starting with detector substrate through SCA test• Identify, develop and acquire talent to meet business growth. Increased team from to 18 to 28 engineers over 2 years to meet business demand◦ Meet regularly with team members to ensure their contribution aligns with business goals◦ Perform bi-annual performance assessments for all team members to provide constructive feedback◦ Maintain a “there are no stupid questions” environment to allow new staff members to learn quickly• Responsible for production and technology development programs for tactical and space based applications at two fabrication facilities:◦ Lompoc, CA: SiPIN & 3 Dimensional Heterogeneous Integrations (3DHI) 200 mm Silicon fab◦ Goleta, CA: Infrared SCA III-V & II-VI fab• Clearly articulate project/program status as well as risks and opportunities associated with these efforts to leadership in verbal, written and presentation formats• Ensure successful program execution through weekly critical program reviews and earned value reporting• Lead RCCA, 8D and failure analysis efforts to address fabrication issues• Manage staffing, compensation and overhead budget• Hold regular staff meeting to flow information down from leadership and share knowledge out from within the team Show less

• Focal Plane Product Engineer

  • Jul 2013 - Oct 2018

  • Integrated Product Team (IPT) lead managing cross functional team to plan and execute semiconductor fabrication of SiPIN sensor chip assemblies• Planned project Integrated Master Schedules (IMS) in Microsoft Project and loaded resources for labor and material• Cost Account Manager (CAM) – Tracked and reported cost and schedule using earned value management techniques for budgets totaling to as much as $10M per year• Effectively presented program status to both internal and external customers monthly in both presentation and written forms to highlight successes and address issues• Extensive knowledge of SiPIN semiconductor wafer processing and fabrication techniques in an ISO 5 (Class 100) cleanroom• Developed and submitted bids to determine cost and schedule for potential future projects Show less

• Focal Plane System Engineer

  • Oct 2011 - Jul 2013

  • Program technology director for the development of a high sensitivity, large dynamic range 8k² visible SCA• Led cross functional engineer team which included Electronics, Mechanical, Software, Test and Operations • Defined and managed customer performance metrics in IBM DOORS and flowed technical requirement down to lower-level specifications with margin to ensure system level success• Ensured robust design by defining specifications, creating design verification plans and coordinating design validation testing between multiple team members and system interfaces• In depth knowledge of SiPIN detector and SCA operation• Developed semiconductor physics models for various detector performance metrics such as: Quantum Efficiency, Background Limited Imaging Performance, Noise Equivalent Irradiance, Angle of incidence based on f#, etc.• Studied potential advanced applications for HgCdTe detectors for space-based applications Show less

• Focal Plane Product Engineer

  • Nov 2007 - Oct 2011

  • IPT lead responsible for facilitating communication of cross functional team• Responsible for overall technical planning and management of design, manufacture, test and delivery of SCAs• Cost Account Manager responsible for maintaining and reporting CPI and SPI to program office, functional management and customers• Managed large Design of Experiments (DOE) to optimize SiPIN visible detector performance to minimize crosstalk between pixels and maximize MTF

• Process Engineer, Hybridization and Large Format Processing

  • Mar 2002 - Nov 2007

  • Large Format Hybridization Team Lead – Developed Hybridization (Flip Chip Bonding) process for next generation large format infrared SCAs• Mechanical Tool Designer – Designed, procured and validated manufacturing tooling• Assisted in procurement of capital equipment to support large format hybridization• Implemented Statistical Process Control to double throughput on high volume SCA process bottleneck• Executed Six Sigma (R6σ) to increase yield of high cost SCA’s from 60% to 90%• Documented process in Process Notebook Show less

• Focal Plane Manufacturing Engineer

  • Jul 2001 - Mar 2002

  • Provided engineering support for manufacturing processing of SCAs• Created and released manufacturing planning derived from engineering requirements• Evaluated and dispositioned non-conforming hardware• Tracked and presented yields to IPT to identify processing excursions early in process• Implemented new tooling to improve yield of Anti-Reflective Coating process using Six Sigma (R6σ) tools