Experience

Fuji Electric (Malaysia) Sdn. Bhd.

• Malaysia
• Semiconductor Manufacturing
• 100 - 200 Employee

• • Dec 2016 - Present

  Team Lead for Back End, Team Lead for Wafer Crack Team, reports directly to DGM.1) Productivity :- Shop floor re-layout / tool relocation to reduce movement- Machine conversion ( manual to auto ) to minimize operator workload- MUDA elimination - Manpower relocation based on workload- Introduction of FIFO system for better control of time coupling lot2) Capacity Improvement- Calculation of machine daily output forecast based on daily equipment availability & efficiency- Process cycle time reduction- Lot size optimization- Implementation of SMED practice to reduce machine downtime3) Cost saving / Inventory Control- Chemical dispense reduction- Material lifetime extension- Material usage forecast calculation4) Yield Improvement- Particle contamination control- Prevention of miss process- Poka Yoke, 5S5) Wafer Crack - Investigation & analysis to reduce wafer cracks / chipping- Implementation of improvement projects6) Others- Assist during audits, jig design, documentation Show less

• • Oct 2012 - Dec 2016

  1. Team lead for Front & Back End Lithography process, 2. Initiates and coordinates module improvements ( productivity, sustaining, yield, cost reduction )3. Perform DOE for RCA ( 6 Sigma ) QA Team. 4. Assistant coordinator for New Product Introduction ( NPI ).5. Process monitoring & improvements ( SPC ).6. Equipment's performance monitoring, verification, calibration to maintain accuracy.7. Machine troubleshooting & performance optimization8. Documentation & generation of procedures ( Ishikawa diagram, SOP, OCAP, ER, ECN, PFMEA, Control Plan, FTA, 5Why, 8D report ). 9. Provide training for new engineers / assign cross-training for knowledge enhancement Show less