Experience

Kionix, Inc.

• United States
• Appliances, Electrical, and Electronics Manufacturing
• 1 - 100 Employee

• Process Development Engineer

  • Oct 2020 - Present

  Lead backend development engineer with a focus on development of lead free glass paste for wafer to wafer bonding. Lead role of production yield improvement activities and transfer of backend activities from engineering to production. *Developed printing and bonding processes for lead free glass paste though initial validation testing. Led an activity Identifying key yield hits and addressing their root causes. Lead backend development engineer with a focus on development of lead free glass paste for wafer to wafer bonding. Lead role of production yield improvement activities and transfer of backend activities from engineering to production. *Developed printing and bonding processes for lead free glass paste though initial validation testing. Led an activity Identifying key yield hits and addressing their root causes.



ROHM Co., Ltd.

• Japan
• Semiconductor Manufacturing
• 500 - 600 Employee

• Process Development Engineer

  • Oct 2018 - Oct 2020

  Accepted an offer at the HQ of Kionix’ parent company Rohm as the lead backend development engineer and the lead role for communication and alignment between Rohm and Kionix teams. *Completed development of a new bonding process for accelerometers including metrology, tool control and ending with successful qualification. Optimized wafer saw process to reduce particle contamination and improve yield by 40%. Accepted an offer at the HQ of Kionix’ parent company Rohm as the lead backend development engineer and the lead role for communication and alignment between Rohm and Kionix teams. *Completed development of a new bonding process for accelerometers including metrology, tool control and ending with successful qualification. Optimized wafer saw process to reduce particle contamination and improve yield by 40%.

• Jr. Process Development Engineer

  • May 2015 - Oct 2018

  Backend process development for gyroscope manufacturing. Worked extensively with metal evaporation/etch to optimize a TiAu “getter” film. Responsible for wafer to wafer bonding process optimization using leaded glass paste. Became the lead for the development of the bonding process for a new accelerometer product.*Optimized, developed metrologies and wrote SOP’s for the TiAu getter and bond processes. Lead a collaboration project with engineers in Cornell master’s program investigating the mechanism and optimization of TiAu getter films. Traveled to Japan as a process expert to advise on the purchase and qualification of Rohm’s metal evaporator.

• Intern Process Development Engineer

  • Oct 2013 - May 2015

  Ensured that development material was processed through a class 1000 fab quickly and efficiently, monitor and report on the progress of material in the fab, process wafers and complete finished product analysis.*Developed a metal etch for titanium and gold, implemented a method to quickly and accurately monitor hydrogen peroxide concentration in a HF etch bath, designed and executed an experiment to determine the source of silicon wafer bow, completed processing and analysis of an optimization bond DOE, processed and analyzed a wafer cleaning process DOE.



State University of New York College at Cortland

• Research Assistant

  • Oct 2014 - May 2015

  Planned, executed and analyzed fluorescence resonance energy transfer reactions (FRET). Prepared buffers, enzyme and substrate solutions. Determined absorption wavelength of an enzyme and various substrates using spectrophotometry. Titrated substrates into enzyme solutions, monitoring absorption to calculate binding constants. Planned, executed and analyzed fluorescence resonance energy transfer reactions (FRET). Prepared buffers, enzyme and substrate solutions. Determined absorption wavelength of an enzyme and various substrates using spectrophotometry. Titrated substrates into enzyme solutions, monitoring absorption to calculate binding constants.