Samuel KP LAW

Senior Design Engineer, R&D at Limbs & Things
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Contact Information
us****@****om
(386) 825-5501
Location
Bristol, England, United Kingdom, UK

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Credentials

  • Learning SOLIDWORKS PDM
    LinkedIn
    Mar, 2023
    - Nov, 2024
  • Advanced Diploma in Project Management - Six Sigma Level 5
    Brentwood Open Learning College
    Jun, 2021
    - Nov, 2024
  • Data Visualization for Data Analysts
    LinkedIn
    Oct, 2019
    - Nov, 2024
  • Excel Data Visualization Part 1: Mastering 20+ Charts and Graphs
    LinkedIn
    Oct, 2019
    - Nov, 2024
  • Project Management
    CEL HK
    Jun, 2018
    - Nov, 2024
  • Management Skills Development
    Dew-Point International Ltd.
    May, 2017
    - Nov, 2024

Experience

  • Limbs & Things
    • United Kingdom
    • Medical Equipment Manufacturing
    • 1 - 100 Employee
    • Senior Design Engineer, R&D
      • Jun 2022 - Present

      Responsible for development (Design, Build & Test) of products from early prototypes to final production and collaborates with Product Managers (PM), Designers & Design Engineers who form part of their project team and liaise with Operation and Production Engineering Teams to supply the project deliverables through the NPD (New Product Development) phases. • Specify and design electromechanical devices that deliver product features and functions. • Produce working, high-quality prototypes, with regards to functional performance, robustness and visual presentation. • Product prototypes are rigorously tested and ready for NPI and handover to L&Ts Production Engineering Team. • Run DFMEA and PFMEA process meetings and manage the associated documentation. • Manage and maintain project CAD files via the PDM system. Show less

  • ASMPT Ltd
    • Singapore
    • Semiconductor Manufacturing
    • 700 & Above Employee
    • Technical Manager II, PRODUCT DEVELOPMENT
      • Jul 2018 - Sep 2021

      Technical leader in next-generation 12" IC die bonder product development:• Advised the development of a new common die bond platform which combined 3 kinds of die bond technology into 1 system for achieving 5um accuracy and 25k UPH • Completed the integration of 3D inspection system for 12" IC die bonder to adapt to material variation including levelling and volume changes • Developed ultra-low 5-gram contact force bonding technology for 50um thin die thickness application • Co-ordinated with internal stakeholders including R&D, QC and business team to achieve project deliverable Show less

    • TECHNICAL MANAGER III, PRODUCT DEVELOPMENT
      • Jul 2015 - Jun 2018

      Next-generation smart machine developer and ball attach product owner, coordinating and managing smart machine framework development, technology transfer and core module design:• Orchestrated several teams to devise a smart machine framework for back-end packaging product family to improve productivity, enable predictive error detection and minimise human intervention • Developed prognostics and health management (PHM) system including detecting abnormal motion axes and predicting machine component lifespan for 12" IC die bonder • Improved process stability and yield by developing model-based process quality management system • Resolved problems related to mechanical design and process and provide technical input in response to client’s new initiatives through attending weekly teleconference with clients worldwide including the US, Malaysia and China Show less

    • Senior Mechanical Design Engineer
      • Jan 2011 - Jun 2015

      Chief mechanical and process designer of ball attach application, managing new generation machine design, process development and task force management:• Increased the UPH, significantly reduced operation set-up time and increase the system utilisation by developing next-generation high ball count BGA ball attach system design and process• Reduced production cost by designing 6-axis ball attach pick-and-place module to achieving automatic coplanarity• Developed and assessed new machine key module reliability design and testing according to international standard including CE and ISO Show less

    • Mechanical Engineer I
      • Jul 2008 - Dec 2010

      Ball attach team sustaining lead, managing overall upgrade module, tooling design and machine development:• Increased the ball counts and decreased the pitch of solder ball by designing high precision singulated BGA package alignment tooling• Ensured product quality by designing JEDEC tray post-reflow inspection system• Resolved design issue by conducting FMEA for 5-phase stepper driver board failure

    • Mechanical Engineer II
      • Jun 2006 - Jun 2008

      Mechanical designer for tooling and module design involving BOM preparation, drawing preparation, manufacturing support and order release:• Reduced yield loss due to human error by designing automatic solder ball refill module with material validation • Enhanced design efficiency by building up parametric model for ball attach tooling design to automatically synchronise customer design information • Increased production yield by designing air curtain for particle control in FM-sensitive area Show less

Education

  • The Hong Kong University of Science and Technology
    Bachelor's degree, Mechanical Engineering
    2003 - 2006
  • The Chinese University of Hong Kong
    Master's degree, System Engineering and Engineering Management
    2011 - 2013

Community

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