Sam Wu
Advanced package development Manager at SPIL 矽品- Claim this Profile
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English Professional working proficiency
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Mandarin Native or bilingual proficiency
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Bio
Experience
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SPIL 矽品
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Taiwan
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Semiconductor Manufacturing
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200 - 300 Employee
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Advanced package development Manager
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Mar 2020 - Present
-Process development for bumping related field (Micro bump/C4/Front side RDLµ pad on Glass)and project management -Process Integration : Release layer ,Photo ,Dry film ,Descum ,Plating ,Bond AOI .) Product: WLCSP ,Micro Bump ,Fan out WLCSP (POP, FO-EB,) -Yield reviewed ,CIP ,DPA analysis -RFI/RFQ Quotation -Design Rule Review/Check,DRC and TRA -Porject management by Gannt Chart Monitor for tooling,Fab out time slot monitor -FAI.CZ.Corner study -Reliability Monitor ,PRU ,Audit -FMEA,control plan ,flow chart ,routing ,recipe define 2015 – 2020 Position: Manager Bumping product integrated department/ Technical support for WLCSP Product 2010 – 2015 SPIL, Taichung, Taiwan Position: Customer service Account manager Technical support for North America/Europe customer service 2006-2009 SPIL, Taichung, Taiwan Position: Senior Engineer of product development Flip chip product development /WLCSP product project management Show less
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Education
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2001 - 2004
National Formosa University
Bachelor's degree, Aeronautical Engineering
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