Robin Dawson

Program Manager at SIONYX
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us****@****om
(386) 825-5501

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Credentials

  • edX Verified Certificate for Photonic Integrated Circuits 1
    edX
    Sep, 2020
    - Nov, 2024

Experience

    • United States
    • Defense and Space Manufacturing
    • 1 - 100 Employee
    • Program Manager
      • Aug 2021 - Present

    • United States
    • Defense and Space Manufacturing
    • 700 & Above Employee
    • Principal Member, Technical Staff
      • Aug 2009 - Aug 2021

      Sensors and Imaging Systems Group Supporting systems designs across technical domains including integrated photonics sensors, integrated Ultra-High Density (iUHD) packaging, Strategic navigation, GPS denied navigation, and biometric development programs. Activities included: Transitioning an integrated photonics sensor IR&D program to a customer funded development starting in 2016. Presently leading the $multi-million/year program. Proposals leading to wins of $15 million for alternate navigation programs. Leading the team on a development program with production follow on. Management of multi-million dollar programs in iUHD packaging technologies. Led the Data Extraction and Imager team on the DARPA SCENICC program developing a high resolution, augmented reality system for situational awareness. Advised several Draper Fellows leading to completed PhDs. Students published on photon counting, picosecond imaging for high resolution depth imaging and Infrared sensors.

    • United Kingdom
    • Semiconductor Manufacturing
    • 500 - 600 Employee
    • Group Leader
      • Oct 2004 - Dec 2009

      Led the imager design group for Digital Imaging Systems. This group is responsible for the analog design and top level integration of the imager designs for Digital Imaging System's modules. This included imager circuit design, on-chip power management, MIPI interface design and overall imager integration. The group also designed module support chips that receive image data, perform image processing, and provide control for the motor drivers in the camera module. Several designs went into production. Spearheaded an effort to complete performance and life testing of camera modules for a module that was produced in volume. Also developed VGA and SXGA camera modules which included coordinating optics designers and suppliers to develop and deliver camera module products.

    • Research Services
    • 1 - 100 Employee
    • Group Head
      • 1993 - 2004

      Driver for programs delivering high performance, deep UV cameras into the semiconductor inspection market. Managed multiple programs including a Sarnoff funded investment, leading Sarnoff into new product lines. Successfully delivered production cameras with stringent specifications and 24/7 operational requirements. The team received the top Sarnoff team award in 2003. Developed customer contacts resulting in contracts with two additional top tier semiconductor inspection equipment vendors. This effort provided experience in developing business contacts and reaching closure on mutually agreed contracts. Proposed and completed the development of a standard camera platform supporting Sarnoff’s imagers produced in Sarnoff’s high performance, back illuminated imaging technology. Played a key role in preparing the proposal, selling the project to the management team and delivering cameras. Proposed and led the delivery of a high-end imager into the next generation weather satellite, NPOESS. This program included coordinating imager design, fabrication, packaging and test within stringent space qualifications. Sarnoff team award in 2004. Delivered devices to support the Quest Schmidt telescope at Palomar. The program included chip design, fabrication, packaging, test and delivery to customer. This focal plane array was used to discover new, large objects in the solar system.

Education

  • Penn State University
    Phd., M.S., Electrical Engineering
  • Princeton University
    B.S.E., EE and CS

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