STAFF ENGINEER (MANUFACTURING – AP BONDER DIVISION)

• Mar 2014 - Present

STAFF ENGINEER (MANUFACTURING – WEDGE BONDER DIVISION)

• Oct 2012 - Mar 2014

ACCOMPLISHMENTS:- Responsible on 3x00 Wedge Bonder Sub-assemblies and Machine Integration Factory set-up in Singapore (Old factory). Lead sourcing, procurement and set-up of tools, fixtures and equipment for qualification of 3x00 Wedge Bonders and its sub-assemblies- Instrumental in KSS factory move and setting up the new K&S Headquarters (2013)

TEAM LEAD, SENIOR ENGINEER (MANUFACTURING – DIE BONDER DIVISION)

• Oct 2009 - Sep 2012

ACCOMPLISHMENTS:- Responsible on Die Bonder machine Factory set-up in Singapore and Die Bonder sub-assemblies Factory set-up in Malaysia. Lead sourcing, procurement and set-up of tools, fixtures, equipments, packaging and end-use material for qualification of Die Bonders and its sub-assemblies - Spearheaded the transfer of Die Bonder Manufacturing & Process technologies from Berg, Switzerland Factory to Singapore.- Lead implementation of various cost reduction and continuous improvement projects- Responsible on providing solutions to various production line issues and concerns to meet shipment deadlines and maintaining high quality product. Show less

SENIOR ENGINEER (MANUFACTURING – BALL BONDER DIVISION)

• Sep 1999 - Sep 2009

ACCOMPLISHMENTS:- Various Position held: (i) Associate Engineer (1999-2004); (ii) Senior Associate Engineer (2004-2005); (iii) Manufacturing Engineer (2005-2007); (iv) Senior Engineer (2007-2009)- Instrumental in Developing and Manufacturing 5 generations, 11 models of Ball Bonders used for IC manufacturing, utilizing Advanced Servo System, Vision Capturing system, I/O Sensor Bus Controllers, Temperature Controllers, Stepper Drivers; UNIX based CPU system and approximately 7000 electro-mechanical parts.- Spearheaded the transfer of Ball Bonder Manufacturing & Process technologies from headquarters in USA to Singapore.- Redesigned and reviewed manufacturing capability from 4 to 40 machines per day through Process Consolidation; Yield Improvement; Supplier Management; In-House FA and Infant Mortality Test, etc. - Formulated and oversee the development of the Infrastructure for the release of all Software from Software Development Group to manufacturing facilities. - Setup the Test Infrastructure for the Qualification of Ball Bonding Equipment using numerous IT, Diagnostic and Instrumentation technology. - Lead the successful qualification of the new Hitachi CCD and vision system ahead of schedule to be used on the latest model of ball bonders. - Drive all Supplier Quality issues and qualify the re-location of main sub-contractor’s manufacturing operation from Singapore to China for mechanical/electrical parts and sub-assemblies.- Successful development of Supplier Quality Improvement Matrix.- Worked closely with various departments to raise safety awareness at plant level, perform safety audits and risk management. - Lead the implementation of Lean manufacturing tools and techniques to minimize production waste and increase productivity. Show less

TECHNICAL SPECIALIST

• Mar 1998 - Sep 1999

ACCOMPLISHMENTS: - Reduced vacuum error breakdowns in TSOP (T-Die) device. - Managed and improved process spare parts control system. - Reduced machine unnecessary power consumption. - Consistent participant in Company’s Proposal & Reward Activities. - Reduced feeding error in Kaijo Bonder FB118A/117/117A machines. ACCOMPLISHMENTS: - Reduced vacuum error breakdowns in TSOP (T-Die) device. - Managed and improved process spare parts control system. - Reduced machine unnecessary power consumption. - Consistent participant in Company’s Proposal & Reward Activities. - Reduced feeding error in Kaijo Bonder FB118A/117/117A machines.

SENIOR PRODUCTION MAINTENANCE ENGINEER

• Nov 1993 - Feb 1998

ACCOMPLISHMENTS: - Spearheaded the transfer of LSI Manufacturing & Process technologies from headquarters in Japan to Philippines. - Performed Mechanical, Electrical and Parameter set-up of over 50 ball bonders assembly equipment to meet product quality standard. - Troubleshoot and perform root cause failure analysis using PM Analysis, 3-Gen Method, and Why? Why? Analysis on ball bonder machines. - Evaluate machine performance and conduct continuous improvement in ball bonder assembly equipment to increase product yield rate and shorten production lead-time. - Develop process preventive measures with the aid of 4-M and PDCA method. - Conduct planned, preventive and corrective maintenance based on TPM method. - Control and maintain product quality within specifications using SEM Equipment and ball bonding quality test and statistical tools. - Generate ball bonder Machine Manuals (operation, troubleshooting, and training). - Increase machines rpm (index) and removed unnecessary sensors. - Developed and conducted bonder related equipment training programs and demonstrated skills to trainees. - Improved ball bonder machines MTBF/MTBA. Show less

Service Crew

• Oct 1990 - Feb 1992

ACCOMPLISHMENTS: - Increased and sustained Regular Customer. - Corrected errors and responded to complaints ACCOMPLISHMENTS: - Increased and sustained Regular Customer. - Corrected errors and responded to complaints