Experience

VISHAY GENERAL SEMICONDUCTOR TAIWAN LTD.

• Taiwan
• Appliances, Electrical, and Electronics Manufacturing
• 1 - 100 Employee

• Chief Engineer

  • Jun 2020 - Present



Chang Wah technology

• Taiwan

• R&D staff engineer

  • Feb 2017 - Jun 2020



Vishay Siliconix Inc

• Taiwan

• Research And Development Engineer

  • Sep 2008 - Feb 2017

  Project management -Package type : Power device / SOP8 / QFN / Flip chip -Simulation ANSYS and multi-physics Package structure simulation by ANSYS mechanical module Package electrical resistance simulation by ANSYS EMAG module Temperature cycling and thermal fatigue simulation with Visco-plastic model (Anand's model) Thermal analysis under Natural convection/ Force convection by ANSYS CFX module -Molding process Support sample build set-up in molding stage. Parameter fine tune New equipment/ New mold chase design New Compound evaluation -Lead-free project. Ag plated wafer with sintering die attach or solder Sliver Sintering material -Chemical deflash process Support sample build set-up in chemical deflash stage. Parameter fine tune -Solder flux cleaning process( machine/solvent) evaluation to improve W/B yield - High Density and big panel L/F design - Failure analysis for the defect products from customer or production line - Handling the raw material abnormality and feedback to raw material vendor - Flip clip device design and development . Show less



walton advanced Engineering

• Semiconductors
• 1 - 100 Employee

• Research and Development Engineer

  • May 2006 - Sep 2008

  Stage: Molding -Package type : CSP / Card device(ex. Micro SD )/SOP8 -New material evaluation and cost reduction. -New process or new device evaluation -High Density and big panel substrate design by 2 block mold cavity. -LED in card type Card type memory package(Patent :US 20090294792 A1) Stage: Molding -Package type : CSP / Card device(ex. Micro SD )/SOP8 -New material evaluation and cost reduction. -New process or new device evaluation -High Density and big panel substrate design by 2 block mold cavity. -LED in card type Card type memory package(Patent :US 20090294792 A1)



ASE Global

• Taiwan
• Semiconductor Manufacturing
• 700 & Above Employee

• Process Engineer

  • Feb 2002 - Jan 2004

  Stage: Molding Package type : PBGA / HSBGA -In charge of evaluation to replace non-green compound to green molding compound. -Process review and optimum and yield maintenance and improvement. -New material evaluation and cost reduction. -Defined and optimum molding parameter to improve warpage/coplanarity issue for PBGA package. -Handling and preparing the 8D or CAR report for customer complaints. Stage: Molding Package type : PBGA / HSBGA -In charge of evaluation to replace non-green compound to green molding compound. -Process review and optimum and yield maintenance and improvement. -New material evaluation and cost reduction. -Defined and optimum molding parameter to improve warpage/coplanarity issue for PBGA package. -Handling and preparing the 8D or CAR report for customer complaints.