Parvin Sherakar

Lead Electronic Hardware Engineer at DTI Group Ltd
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Contact Information
us****@****om
(386) 825-5501
Location
AU
Languages
  • English -
  • Hindi -
  • Marathi -

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5.0

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Dan Zorde

Parvin's time at DTI was largely spent working on large scale rail projects under tight budgets and delivery deadlines. She was heavily involved in developing embedded processor products, testing and delivering the documentation to go with the products. Additionally to product development she also developed a set of in-house test procedures for our ISO compliance requirements. Her skill and dedication to getting fully involved in any and all tasks put to her is exemplary. Without a doubt she is a very capable engineer that relish in challenges.

Mike Hanssen

Parvin worked for 2 years for me in the hardware team at DTI on multiple complex rail products. They were all ground up developments, and she was involved in every part, from circuit design, PCB layout, mechanical integration, production, software testing, type testing (EMC, thermal, EN50155) and documentation. She was always hard working, dedicated and a pleasure to have in the team.

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Credentials

  • Six Sigma Green Belt
    Honeywell Automation India Limited
    Dec, 2008
    - Oct, 2024

Experience

    • Lead Electronic Hardware Engineer
      • Jun 2020 - Present
    • Singapore
    • Entertainment Providers
    • 1 - 100 Employee
    • Senior Electronic Engineer
      • May 2018 - Jun 2020

      • Design with iMX6, DDR3L, EMMC based Smart Card readers • RFID, WiFi and Bluetooth module interface, Magnetic card interface • High speed PCB layout, 8 layers Rigid and 2 Layers Flex PCBs • EMI/EMC Design, Testing and Environmental testing • CE, FCC and BIS Certification • Documentation including Test plan and Test reports • Automated test jig designs and review • Mentoring junior engineers and leading hardware design • Co-ordination with Industrial designers, Firmware engineers, Production team and Factory

    • United States
    • Machinery Manufacturing
    • 1 - 100 Employee
    • Electronic Engineer
      • Feb 2018 - May 2018

      • Design review as per EMC and Safety standards • Design review as per EMC and Safety standards

    • Electronic Design Engineer
      • Oct 2015 - Jan 2018

      • Design and Testing of iMX 6 Quad Core/ dual core, based products including Internal and External LED matrix displays, Touch screen Driver panel display, Dynamic Route LCD Display, Passenger Emergency Intercom • DC-DC Power supply design • Worked on Altium PCB design tool, Layout for 6-layer board, Rigid + Flex type of board • Worked on technologies including DDR2 RAM, 100MB Managed switch, USB2/3 • High speed SPI signals interface, LVDS signal interfaces design and testing of large LED displays • EMI/EMC Testing and Environmental testing based on EN 50155 standard and related IEC standards • Documentation including Test plan and Test reports • Cables design for power, SPI and LVDS signals considering fire certified material as UL3385 XLPE

    • India
    • IT Services and IT Consulting
    • 700 & Above Employee
    • Specialist- Medical Electronics Hardware
      • Jun 2013 - Jun 2015

      • Design and Testing of Hardware Boards of Infusion Pumps • Design and Testing of iMX 6 Dual Core based Video Streamer for zooming of text and image application with Wi-Fi, HDMI and USB 3.0 interface • EMI/EMC Testing of Infusion Pump • FMEA Analysis and Verification of Negative Pressure Wound Theory System • Design and Testing of Hardware Boards of Infusion Pumps • Design and Testing of iMX 6 Dual Core based Video Streamer for zooming of text and image application with Wi-Fi, HDMI and USB 3.0 interface • EMI/EMC Testing of Infusion Pump • FMEA Analysis and Verification of Negative Pressure Wound Theory System

    • Senior Hardware Engineer
      • Jan 2011 - Jun 2012

      • Design, Development and Testing of OMAP (ARM + DSP) based High Speed Telemetry System for Down Hole Drilling Application for Baker Hughes, USA • Hardware Requirements, Design, Test Plan and Verification Documents Preparation • Board Bring up and Functional Testing • Design, Development and Testing of OMAP (ARM + DSP) based High Speed Telemetry System for Down Hole Drilling Application for Baker Hughes, USA • Hardware Requirements, Design, Test Plan and Verification Documents Preparation • Board Bring up and Functional Testing

    • Design engineer
      • May 2008 - Dec 2010

      • Re Design and Testing of Fire Alarm Control System • SMPS Circuit Design, Procurement of Component, Fabrication, Assembly and Testing. • Identification of non-RoHS, Obsolete Parts and low-cost alternate parts • Re Design and Testing of Fire Alarm Control System • SMPS Circuit Design, Procurement of Component, Fabrication, Assembly and Testing. • Identification of non-RoHS, Obsolete Parts and low-cost alternate parts

    • Hardware Design Engineer
      • Jan 2007 - Apr 2008

      • Hardware Board Testing of Intelligent Electronic Devices Input and Output Modules • EMC and Environmental testing • Hardware Board Testing of Intelligent Electronic Devices Input and Output Modules • EMC and Environmental testing

    • India
    • Telecommunications
    • 100 - 200 Employee
    • R & D Engineer
      • Sep 2005 - Dec 2006

      • Design and Testing of Emergency Module Hardware and Electronics Ballast • Procurement of Components, Board assembly and Testing • Design and Testing of Emergency Module Hardware and Electronics Ballast • Procurement of Components, Board assembly and Testing

Education

  • DKTE, Ichalkaranji (Shivaji University)
    Bachelor of Engineering (BE), Electronics
    2003 - 2005
  • Walchand college of engineering, Sangli, Maharashtra
    Diploma, Industrial Electronics
    2000 - 2002

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