Experience

VisIC Technologies Ltd.

• Israel
• Semiconductor Manufacturing
• 1 - 100 Employee

• Sr. R&D IC and Power Packaging Engineer

  • Jun 2019 - Present

  VisIC Technologies develop and market high power transistor products based upon compound semiconductor Gallium Nitride (GaN) material aiming to replace most of the Silicon (Si) products used in power conversion systems. • Design of GaN Power Semiconductor packages (discrete + modules). • Prototyping, Manufacturing and Assembling processes. • QA/QC processes and improvements + yield increasing. • Adhesives system definition and qualifying. • Cleaning processes and surface… Show more VisIC Technologies develop and market high power transistor products based upon compound semiconductor Gallium Nitride (GaN) material aiming to replace most of the Silicon (Si) products used in power conversion systems. • Design of GaN Power Semiconductor packages (discrete + modules). • Prototyping, Manufacturing and Assembling processes. • QA/QC processes and improvements + yield increasing. • Adhesives system definition and qualifying. • Cleaning processes and surface treatments/modification. • Failure Analysis. • Transfer Assembling processes to mass production (Assembling Houses). Show less VisIC Technologies develop and market high power transistor products based upon compound semiconductor Gallium Nitride (GaN) material aiming to replace most of the Silicon (Si) products used in power conversion systems. • Design of GaN Power Semiconductor packages (discrete + modules). • Prototyping, Manufacturing and Assembling processes. • QA/QC processes and improvements + yield increasing. • Adhesives system definition and qualifying. • Cleaning processes and surface… Show more VisIC Technologies develop and market high power transistor products based upon compound semiconductor Gallium Nitride (GaN) material aiming to replace most of the Silicon (Si) products used in power conversion systems. • Design of GaN Power Semiconductor packages (discrete + modules). • Prototyping, Manufacturing and Assembling processes. • QA/QC processes and improvements + yield increasing. • Adhesives system definition and qualifying. • Cleaning processes and surface treatments/modification. • Failure Analysis. • Transfer Assembling processes to mass production (Assembling Houses). Show less



Philips

• Netherlands
• Hospitals and Health Care
• 700 & Above Employee

• Sr. R&D Mechanical Engineer

  • Nov 2016 - Jun 2019

  • Design, Manufacturing and assembling processes definitions & development of CT X-Ray detectors. • Manufacturing and Assembling technologies research and development. • Design of assembling line and manufacturing aids. • QA/QC processes and improvements + yield increasing. • Adhesives system definition and qualifying. • Cleaning processes and surface modification. • Design, Manufacturing and assembling processes definitions & development of CT X-Ray detectors. • Manufacturing and Assembling technologies research and development. • Design of assembling line and manufacturing aids. • QA/QC processes and improvements + yield increasing. • Adhesives system definition and qualifying. • Cleaning processes and surface modification.



Tetro Ltd.

• China
• Consumer Goods
• 1 - 100 Employee

• CPO

  • Jan 2015 - May 2016

  Consumer goods Mass production manufacturing and assembly arrays Architecture. Design, Manufacturing and assembly processes definitions & improvements. Inline problem solving. QA/QC processes and improvements + yield increasing.

• Tricycles & Baby Strollers Division Manager

  • Jun 2013 - Dec 2014

  Managing assembly divisions of consumer goods. (Mass production) Process and assembly engineering. Products improvements and Inline problem solving. QA/QC processes and improvements + yield increasing. Customers support.



ElectroPack

• Kfar Bialik,Israel

• Owner

  • Jan 2008 - May 2013

  Mechanical development and design service provider. Worked with incubator ,SU and mature companies in the fields of - Electronics Packaging Military Equipment Medical Devices Clean/renewable energy Process support equipment Mechanical development and design service provider. Worked with incubator ,SU and mature companies in the fields of - Electronics Packaging Military Equipment Medical Devices Clean/renewable energy Process support equipment



ColorChip

• Israel
• Telecommunications
• 1 - 100 Employee

• Mechanical Engineer

  • 2006 - 2007

  The company developed an optical Transceiver (SoG – System on Glass). Design of component and system level packaging (Wafer Level Packaging & Chip Scale Packaging on Glass Substrate). Mechanical design, production and assembly of machinery and equipment that support and improve the yield of production processes. Overall development, design, production and assembly processes. The company developed an optical Transceiver (SoG – System on Glass). Design of component and system level packaging (Wafer Level Packaging & Chip Scale Packaging on Glass Substrate). Mechanical design, production and assembly of machinery and equipment that support and improve the yield of production processes. Overall development, design, production and assembly processes.



XLoom Communications

• TLV

• Senior Mechanical Engineer

  • 2002 - 2006

  Development design, production and assembly of an optical transceiver (Wafer Level Packaging (WLP) on Glass Substrate). Mechanical development, design, production and assembly of machinery and equipment that confirm feasibility of concepts and support prototypes manufacturing. Development design, production and assembly of an optical transceiver (Wafer Level Packaging (WLP) on Glass Substrate). Mechanical development, design, production and assembly of machinery and equipment that confirm feasibility of concepts and support prototypes manufacturing.



Memlink

• Hertzeliya

• Packaging Team Leader

  • Aug 2000 - Oct 2002

  The company developed a MEMS based optical switch. (Si substrate). Design of components & system packages (Wafer Level Packaging) . Design of process support equipment. (Accurate motion,Imaging,Gluing). The company developed a MEMS based optical switch. (Si substrate). Design of components & system packages (Wafer Level Packaging) . Design of process support equipment. (Accurate motion,Imaging,Gluing).



Elco Industries Ltd.

• Barkan + Hod Hasharon - Israel

• Engineering Manager (Barkan Branch)

  • Mar 1998 - Jul 2000

  The factory developed and produced High-Voltage switching systems and transformers for customers in Israel and around the world. Managing the engineering ,manufacturing teams (3 engineers+25 line workers) and design/assembly subcontractors. Developing, design, production and assembly of various switching systems (Air Breakers , GIS Switches and Cellular stations power supply systems). Working under ISO and IEC Standards. The factory developed and produced High-Voltage switching systems and transformers for customers in Israel and around the world. Managing the engineering ,manufacturing teams (3 engineers+25 line workers) and design/assembly subcontractors. Developing, design, production and assembly of various switching systems (Air Breakers , GIS Switches and Cellular stations power supply systems). Working under ISO and IEC Standards.



Israel Electric Company

• Ashkelon

• Field Engineer

  • Jul 1995 - Mar 1998

  Power piping and Welding Dep. Field Engineer Transfer to production and assembly of main power pipelines of the Rothenberg power plant in Ashkelon. Power piping and Welding Dep. Field Engineer Transfer to production and assembly of main power pipelines of the Rothenberg power plant in Ashkelon.



Integral Form

• Kfar Saba

• Mechanical Engineer

  • Jun 1994 - Jul 1995

  Design of mamography compression control mechanism. Design of mamography compression control mechanism.