Experience

Carsem (M) Sdn. Bhd.
• Appliances, Electrical, and Electronics Manufacturing
• 100 - 200 Employee
• Process engineer (wire bond)

  • Mar 2022 - Present

ASIATIC Plastic Packaging
• Malaysia
• Packaging and Containers Manufacturing
• 1 - 100 Employee
• Product Specialist

  • Nov 2021 - Mar 2022


Texas Instruments

• United States
• Semiconductor Manufacturing
• 700 & Above Employee

• Engineering Trainee

  • Mar 2021 - Aug 2021

  Trainee for process end of line. Handling some projects and tasks for semiconductor industry for ic packaging process. Able and understand the process for wire bonding, molding (encapsulation), laser mark, plating and die attach. Trainee for process end of line. Handling some projects and tasks for semiconductor industry for ic packaging process. Able and understand the process for wire bonding, molding (encapsulation), laser mark, plating and die attach.



Western Digital

• United States
• Computer Hardware Manufacturing
• 700 & Above Employee

• Electronic Technician

  • Apr 2017 - Sep 2017

  Assembling, evaluating, testing, and maintaining electrical or electronicwiring, equipment, appliances, and apparatus.Troubleshooting and repairing malfunctioning equipment, appliances, andapparatus.Constructing and fabricating parts, using hand tools and specifications.Reading and interpreting electrical and electronic circuit blueprints,diagrams, and schematics.Ordering of electrical supplies and equipment.

• Internship Trainee

  • Nov 2016 - Apr 2017

  Trainee at backend department handling Neptune tester and KUKA robots.Able to multi task and work under pressure.Learned about lots of process for hardisk testing.