Experience

元太科技工業股份有限公司

• Appliances, Electrical, and Electronics Manufacturing
• 1 - 100 Employee

• Project assistant manager

  • May 2017 - Present



沛喆科技股份有限公司

• 新竹地區

• RD section manager

  • Jun 2013 - Sep 2016

  1. Co-work with Silicon foundry to integrate whole MEMS pressure sensors process for mass production in C25, 6" foundry. 2. Develop digital pressure sensors for consumer applications with sensor chips from Cavity_SOI wafer. 3. Market trend survey and new technologies tracing. 1. Co-work with Silicon foundry to integrate whole MEMS pressure sensors process for mass production in C25, 6" foundry. 2. Develop digital pressure sensors for consumer applications with sensor chips from Cavity_SOI wafer. 3. Market trend survey and new technologies tracing.



全磊微機電股份有限公司

• 新竹地區

• MEMS staff engineer

  • Apr 2010 - May 2013

  1. Hosted to design the smallest pressure sensor chips for cardiac catheterization surgery. 2. Manage outsourcing foundries to develop & manufacture the pressure sensors with the minimum pressure range. 3. Develop the process flow of above sensors which innovated one US patent.(US8590389) 1. Hosted to design the smallest pressure sensor chips for cardiac catheterization surgery. 2. Manage outsourcing foundries to develop & manufacture the pressure sensors with the minimum pressure range. 3. Develop the process flow of above sensors which innovated one US patent.(US8590389)



Fukuoka Shabu- shabu

• 新竹地區

• Manager

  • Aug 2008 - Aug 2009

  1. Try to start a business with friends. Choose target, location, and fund-raising. 2. Handle whole store including setting up, promoting, and managing daily operation. 1. Try to start a business with friends. Choose target, location, and fund-raising. 2. Handle whole store including setting up, promoting, and managing daily operation.



TSMC

• Taiwan
• Semiconductor Manufacturing
• 700 & Above Employee

• Senior Engineer

  • Apr 2003 - Aug 2007

  1. Familiar with Thin-film process. Being owner of HDP-FSG、BPSG for C13 to C25 technology. (0.13um~0.25um) 2. Improved the productivity by enhanced process stability and increased the available time of equipment. 1. Familiar with Thin-film process. Being owner of HDP-FSG、BPSG for C13 to C25 technology. (0.13um~0.25um) 2. Improved the productivity by enhanced process stability and increased the available time of equipment.