Experience

HORIBA Scientific

• Research Services
• 700 & Above Employee

• PCB Designer / Librarian

  • Apr 2011 - Present

  I am working with Mentor Expedition and DxDesigner. I am working with Mentor Expedition and DxDesigner.



Jackson and Tull

• United States
• Defense and Space Manufacturing
• 1 - 100 Employee

• PCB Design Engineer

  • Apr 2010 - Apr 2011



Andrew Corporation

• Telecommunications
• 400 - 500 Employee

• PCB Design Engineer

  • Nov 2008 - Oct 2009

  * Multi-layer High Density boards using PADs * RF Designs using PADs * Digital Designs using PADa * Multi-layer High Density boards using PADs * RF Designs using PADs * Digital Designs using PADa



Motorola Mobility (a Lenovo Company)

• United States
• Computers and Electronics Manufacturing
• 700 & Above Employee

• PCB Design Engineer

  • Jan 2007 - Nov 2008

  * Multi-layer High Density boards using Allegro * RF Designs using Allegro * Digital Designs using Allegro * Mixed Signal Designs using Allegro * Controlled Impedance Designs * Multi-layer High Density boards using Allegro * RF Designs using Allegro * Digital Designs using Allegro * Mixed Signal Designs using Allegro * Controlled Impedance Designs



ATI Technologies, Inc. / AMD Inc,

• PCB Design Engineer

  • Feb 2003 - Nov 2006

  * RF Designs using Allegro and PowerPCB (Pads) * Digital Designs using Allegro and PowerPCB (Pads) * Mixed Signal Designs using Allegro and PowerPCB (Pads) * Controlled Impedance Designs * RF Designs using Allegro and PowerPCB (Pads) * Digital Designs using Allegro and PowerPCB (Pads) * Mixed Signal Designs using Allegro and PowerPCB (Pads) * Controlled Impedance Designs



Multilink Technology, Inc.

• PCB Design Engineer

  • Apr 2001 - Aug 2002

  * RF Designs with Transmission lines up to 40GHz * RF Designs with Differential Pairs up to 800MHz using OrCAD and PowerPCB(Pads) * RF Designs with Transmission lines up to 40GHz * RF Designs with Differential Pairs up to 800MHz using OrCAD and PowerPCB(Pads)



Motorola

• PCB Design Team Leader

  • Sep 1996 - Apr 2001

  * Team Leader for PCB Designers for CDMA Phones * Team Leader for Mentor Graphics Library Conversion * Team Leader for Process Implementation & Documentation * Team Leader for Naming Specifications Development * Mentor Migration Team * New Parts Request via WEB Development Team * Mentor to Sherpa Integration Development Team using Mentor Graphics Multi-Layer Board Designer / Mentor Graphics Librarian * Multi-Layer HDI and Non-HDI Printed Wiring Board Design in: * RF / Audio Logic areas * Flex Circuits * Power Supplies * Mentor Graphics Librarian for Global Wireless Products Group * Provided Support to Designers and Engineers Show less



Brother International, Corp.

• PCB Designer / Librarian

  • Feb 1994 - Aug 1996

  * Micro Controller / Digital Communication Boards (multi -layer) * DC-DC Power Supply Boards (single and double sided) using Mentor Graphics * Micro Controller / Digital Communication Boards (multi -layer) * DC-DC Power Supply Boards (single and double sided) using Mentor Graphics